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Content archived on 2024-05-21

Ultrasonic plating technique for low cost, clean, high-speed, high precision plating for electronic components and microsystems

Objective

Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.

Call for proposal

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Coordinator

INSTITUTE FOR PRODUCT DEVELOPMENT
EU contribution
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Address
DTU, Kemitorvet, bygninh 204
2800 LYNGBY
Denmark

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Total cost
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Participants (7)