Objective
Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
2800 Lyngby
Denmark
Participants (7)
Electrum 236 Kista
58183 Linkoeping
5616 LW Eindhoven
3550 Slangerup
81739 Muenchen
2300 Koepenhagen
Cork