Ultrasonic plating technique for low cost, clean, high-speed, high precision plating for electronic components and microsystems

Objective

Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

INSTITUTE FOR PRODUCT DEVELOPMENT

Address

Dtu, Kemitorvet, Bygninh 204
2800 Lyngby
Denmark

Participants (7)

ACREO AB.

Sweden

Address

Electrum 236
Electrum 236 Kista

LINKOEPING UNIVERSITY

Sweden

Address

Fysikhuset, Infart, 4, Valla
58183 Linkoeping

PGE B.V.

Netherlands

Address

Glaslaan, 2
5616 LW Eindhoven

RESON A/S

Denmark

Address

13,Fabriksvangen 13
3550 Slangerup

SIEMENS AG

Germany

Address

6,Otto-hahn-ring 6
81739 Muenchen

TCD TEKNOLOGI APS

Denmark

Address

Genuavej 44
2300 Koepenhagen

UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland

Address

Lee Maltings, Prospect Row
Cork