Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.
Call for proposalData not available
Funding SchemeCSC - Cost-sharing contracts
5616 LW Eindhoven