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Ultrasonic plating technique for low cost, clean, high-speed, high precision plating for electronic components and microsystems

Objective

Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

INSTITUTE FOR PRODUCT DEVELOPMENT
Address
Dtu, Kemitorvet, Bygninh 204
2800 Lyngby
Denmark

Participants (7)

ACREO AB.
Sweden
Address
Electrum 236
Electrum 236 Kista
LINKOEPING UNIVERSITY
Sweden
Address
Fysikhuset, Infart, 4, Valla
58183 Linkoeping
PGE B.V.
Netherlands
Address
Glaslaan, 2
5616 LW Eindhoven
RESON A/S
Denmark
Address
13,Fabriksvangen 13
3550 Slangerup
SIEMENS AG
Germany
Address
6,Otto-hahn-ring 6
81739 Muenchen
TCD TEKNOLOGI APS
Denmark
Address
Genuavej 44
2300 Koepenhagen
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland
Address
Lee Maltings, Prospect Row
Cork