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Contenido archivado el 2024-05-21

Ultrasonic plating technique for low cost, clean, high-speed, high precision plating for electronic components and microsystems

Objetivo

Mass transport control is a critical parameter in electrodeposition of metals and alloys. ULTRAPLATE proposes a new technique for enhanced mass transport, using multi-mode ultrasonics, combined with pulse-plating. The innovative ULTRAPLATE- idea will be developed and used throughout this project to offer unsurpassed process- and microstructure-property control of deposited metals and alloys. The project is industry-driven with focus on development of new methods for: High- speed reel-to-reel plated lead-free solder contacts, electroformed moulds for polymer precision-products (parallel optical links, CD/DVD's, microfluidics) and magnetic alloys for micro-transformers. These applications require improved plating-techniques for alloy control, geometric plating precision, speed, versatility, ease of use and cleanliness. Offering all this, the ULTRAPLATE- technique will bring new business opportunities to European industry.

Ámbito científico (EuroSciVoc)

CORDIS clasifica los proyectos con EuroSciVoc, una taxonomía plurilingüe de ámbitos científicos, mediante un proceso semiautomático basado en técnicas de procesamiento del lenguaje natural.

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Convocatoria de propuestas

Data not available

Régimen de financiación

CSC - Cost-sharing contracts

Coordinador

INSTITUTE FOR PRODUCT DEVELOPMENT
Aportación de la UE
Sin datos
Dirección
DTU, Kemitorvet, bygninh 204
2800 LYNGBY
Dinamarca

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Coste total
Sin datos

Participantes (7)