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Content archived on 2024-05-14

PATTERNING BY UV LASER MATERIAL REMOVAL

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

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The project has identified, that using UV laser in combination with scanner technology is a versatile tool for laser micro machining. By using scanner devices for beam positioning instead of linear axis stages, a much higher processing speed can be reached, which makes such a tool a competitive alternative for processing large scaled work pieces. The reachable accuracy is better than 10 µm (depending on the used focal length), and the repetition rates of used laser sources in the UV-range are available of up to 100 kHz. The used UV-wavelength of 355 nm can be used for a broad range of materials. This includes plastics, ceramics, some glasses, semi-conductors and in few applications also metals. By using high repetition rate lasers with lower pulse energies, a high resolution in the depth control with acceptable processing speed can be achieved.

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