PATTERNING BY UV LASER MATERIAL REMOVAL

Informazioni relative al progetto

PURE

ID dell’accordo di sovvenzione: IN20668I

Data di avvio

Data di completamento

Finanziato da

• Specific programme for the dissemination and exploitation of the results of activities in the field of research, technological development and demonstration, 1994-1998

Costo totale

Nessun dato

Contributo UE

Nessun dato

Coordinato da

LASER ZENTRUM HANNOVER E.V.
Germany

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Risultati sfruttabili

Extended knowledge on laser based micro-machining using UV-laser and scanner technology and construction of a laboratory prototype

The project has identified, that using UV laser in combination with scanner technology is a versatile tool for laser micro machining. By using scanner devices for beam positioning instead of linear axis stages, a much higher processing speed can be reached, which makes such a tool a competitive alternative for processing large scaled work pieces. The reachable accuracy is better than 10 µm (depending on the used focal length), and the repetition rates of used laser sources in the UV-range are available of up to 100 kHz. The used UV-wavelength of 355 nm can be used for a broad range of materials. This includes plastics, ceramics, some glasses, semi-conductors and in few applications also metals. By using high repetition rate lasers with lower pulse energies, a high resolution in the depth control with acceptable processing speed can be achieved.