The project aims to develop next generation capacitive MEMS components for precision applications. The industries directly targeted are MEMS sensor industry and test & measurement industry. In addition to generic MEMS process technology suitable to any capacitive sensor fabrication, the project intends to develop prototype components for high precision dc, low frequency and rf/microwave voltage and field measurements.
The project will open new application fields for the microsystem technology by improving the electromechanical stability of micromechanical capacitive transducers that are generic building blocks of Micro Electro Mechanical Systems (MEMS).
The specific objectives are:
1) To develop MEMS sensor technology for precision applications by improving the electromechanical stability of micromechanical capacitive transducers;
2) To apply the technology in new types of electrical references for dc, low-frequency and high-frequency test and measurement applications;
3) To analyse the potential of developed components and solutions in existing and novel industrial products and applications.
DESCRIPTION OF WORK
- Definition of target specifications for processes and components;
-Definition of process requirements;
- Analysis of instability components of present MEMS technology;
- Development of MEMS process technology with improved properties for low frequency and high frequency applications. Design and fabrication of the new dc, low-frequency and high-frequency components (2 generations).
Characterisation of the properties of the components using high-precision measurements. Exploitation plan for the process and component technology.
Funding SchemeCSC - Cost-sharing contracts
NR6 6JB Norwich, Norfolk
2600 AR Delft
7522 NB Enschede