Objective
This project will allow to reduce the manufacturing cost and time to market of wireless broadband terminals by developing the key technologies required for the production in volume of millimeterwave transceiver:
- new passivation techniques and packages for the GaAs MMICs
- integration of passive functions (filters) in printed circuit boards
- enhancement of standard surface assembly processes.
These technologies will be integrated and validated in a 0.5 watt high performance module.
This project intends to create a new standard for the assembly of millimeterwave communications systems.
Objectives:
The aim of the project is to extend up to the Ka band the SMT insertion techniques, which have already proven to be cost effective up to the X band. In order to achieve this, SMT organic and LTCC packages with high resonant frequencies (>40GHz) will be developed. GaAs will be enhanced by protection with BCB layer and a specific power MMIC will be developed. High performance filters on printed board will be studied. Laminate substrates applicable up to the Ka band will be investigated for SMT assembly. All these technologies will be assessed by the assembly and the validation of a complete transceiver module.
Work description:
The project is divided in 9 workpackages:
WP1: Management WP leader: TMW FRANCE;
WP2: Specification of the transceiver module WP leader: ALCATEL-WTD ITALY;
WP3: Development of the transceiver WP leader: TMW FRANCE;
WP4: Simulation of filters, packages WP leader: TNO HOLLAND;
WP5: GaAs technology enhancement and MMIC development WP leader: UMS GERMANY;
WP6: Development of the LTCC SMT packages WP leader: TMI FRANCE;
WP7: Development of the power organic SMT package WP leader: LABTECH UK;
WP8: Assembly of the transceiver WP leader: TMW FRANCE;
WP9: Validation of the transceiver WP leader: ALCATEL-WTD ITALY.
Milestones:
The duration of the project is 30 months with a review meeting every 6 months.
The milestones are:
- the specification of the transceiver at T0+6;
- the development of the packaged MMICs at T0+18;
- the manufacturing of the transceiver at T0+24;
- the validation of the transceiver at T0+30.
Fields of science (EuroSciVoc)
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Programme(s)
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Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
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Funding Scheme
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Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
75008 PARIS
France
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.