Objective
The project objective is to investigate the application of microelectronics integration and packaging techniques to the radio front end for mobile and wireless telephones of different standards operating at 900 MHz (GSM), 1.5 GHz (Immarsat M), 1.8 GHz (DCS 1800/PCN) and 1.9 GHz (DECT). Emphasis will be given to evolution from second generation terminals toward UMTS, by creating a library of basic radio frequency building blocks, ie. transmit mixers, receive mixers, phase shifters, VCO, and PLL, in a high frequency silicon bipolar process suitable for multi-standard operation. Novel techniques will be investigated and developed, to have a major impact on low-cost, high volume packaging for RF integrated front end applications.
The application has been investigated of microelectronics integration and packaging techniques to the radio front end for mobile and wireless telephones of different standards operating at 900 MHz, 1.5 GHz, 1.8 GHz and 1.9 GHz. Emphasis was given to evolution from second generation terminals towards universal mobile telecommunications system (UMTS), by creating a library of basic radio frequency building blocks (ie transmit mixers, receive mixers, phase shifters voltage controlled oscillators (VCO) and phase locked loops (PLL)) in a high frequency silicon bipolar process suitable for multistandard operation. Following the definition of the radio frequency (RF) specifications, (focused mainly on a homodyne structure, but with application to others), and a study of heterodyne image rejection architectures, the project concentrated on the design, fabrication and test of a set of low voltage (2.7 V), low power basic RF building blocks and combinations of the latter, using an ESPRIT (TIP BASE) developed high frequency bipolar process. In parallel, an electroless chip bumping process is being developed, with special consideration to RF characteristics. The chips themselves are to be assembled using electroless bumps and tape automated bonding (TAB) flip chip techniques. First results have been obtained on nickel bumping and the flip chip process.
Technical Approach
Following the definition of the RF specifications, (focused mainly on a homodyne structure, but with application to others), and a study of heterodyne image rejection architectures, the project now concentrates on the design, fabrication and test of a set of low voltage (2.7V) low power basic RF building blocks and combinations of the latter, using an ESPRIT (TIP BASE) developed high-frequency bipolar process. In parallel, an electroless chip bumping process is being developed, with special consideration to RF characteristics. The chips themselves are also being developed, especially the integrated front ends. These will be assembled using electroless bumps and TAB/flip-chip techniques.
Key Issues
- Zero-IF receiver for multi-standard operation.
- Digital low IF Image Rejection receiver design.
- Low voltage (2.7V) low power RF operation.
- Low cost, high volume RF packaging.
Expected Impact
Project results will contribute to the UMTS standardisation with the experience and results of the project, in terms of the techno-economic feasibility scope.
Results will be useful to designers and manufacturers of mobile, wireless, UMTS and integrated satellite and cellular mobile systems terminals, and potentially base stations, by providing basic building block and packaging techniques for low voltage, low power, highly integrated RF front end components that will help reduce their cost, volume and weight. In this way, the project may facilitate the penetration of mobile and wireless equipment suitable to perform UMTS services in the market.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering information engineering telecommunications radio technology radio frequency
- natural sciences chemical sciences inorganic chemistry transition metals
- engineering and technology mechanical engineering vehicle engineering aerospace engineering satellite technology
- natural sciences physical sciences electromagnetism and electronics microelectronics
- natural sciences chemical sciences inorganic chemistry metalloids
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
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Coordinator
28045 MADRID
Spain
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.