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Photonic Wafer-Level Integration Packaging and Test

Objective

PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. SMT is the most widely used, cost-effective and standardised package in the electronics world and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging and high-throughput PIC testing. PhotonicLEAP will also develop standardised packaging design rules formalised into a Process Design Kit (PDK), providing users with easy access to the project technology through Open Access and commercial PIC design software tools. The project will validate these technologies through two state-of-the-art demonstrators, including a high-speed optical communication module and a portable medical device for cardio-vascular diagnostics. PhotonicLEAP’s approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and creating completely new markets. The project workplan includes high-quality measures to Exploit and Disseminate PhotonicLEAP’s results, including management of IP and research data, and to Communicate project activities to different target audiences. A key exploitation measure involves technology transfer to the flagship European PIC Packaging Pilot Line, PIXAPP, which has an extensive and growing user-base across multiple markets. PhotonicLEAP will be delivered by a highly experienced consortium with an unmatched record of excellence in developing and delivering many world firsts in PIC packaging, test technologies and advanced services. The consortium brings a wealth of interdisciplinary skills and state-of-the-art infrastructure to deliver on the project’s ambitious objectives.

Call for proposal

H2020-ICT-2020-2
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Address
Western Road
T12 YN60 Cork
Ireland
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 1 129 856,25

Participants (7)

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
EU contribution
€ 1 550 415
Address
Hansastrasse 27C
80686 Munchen
Activity type
Research Organisations
LPKF LASER & ELECTRONICS AG
Germany
EU contribution
€ 550 000
Address
Osteriede 7
30827 Garbsen
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
FICONTEC IRELAND LIMITED
Ireland
EU contribution
€ 822 375
Address
Tyndall National Institute, Lee Maltings Complex, Dyke Parade
T12 R5CP Cork
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
SUSS MICROOPTICS SA
Switzerland
EU contribution
€ 486 750
Address
Rouges Terres 61
2068 Hauterive
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
ROBERT BOSCH GMBH
Germany
EU contribution
€ 280 000
Address
Robert-bosch-platz 1
70839 Gerlingen-schillerhoehe
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands
EU contribution
€ 549 841,25
Address
Groene Loper 3
5612 AE Eindhoven
Activity type
Higher or Secondary Education Establishments
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 575 780
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations