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Photonic Wafer-Level Integration Packaging and Test

Project description

Breakthrough photonic integrated and packaging technology

The EU-funded PhotonicLEAP project plans to develop a disruptive wafer-level photonic integrated circuit (PIC) module integration, packaging and test technology which can be scaled from low to very large volumes. The project will leverage the new developments to produce a surface mount technology (SMT) package that will incorporate for the first time multiple optical and electrical connections. PhotonicLEAP's SMT approach is set to become a new global standard for cost-effective PIC packaging and high-throughput PIC testing. The technologies will be validated in two state-of-the-art demonstrators: a high-speed optical communication module and a portable medical device for cardiovascular diagnostics. PhotonicLEAP's approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and opening completely new markets.

Call for proposal

H2020-ICT-2018-20

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Sub call

H2020-ICT-2020-2

Coordinator

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Net EU contribution
€ 1 129 856,25
Address
Western Road
T12 YN60 Cork
Ireland

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Region
Ireland Eastern and Midland Dublin
Activity type
Higher or Secondary Education Establishments
Non-EU contribution
€ 0,00

Participants (7)

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany
Net EU contribution
€ 1 550 415,00
Address
Hansastrasse 27c
80686 Munchen

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Region
Bayern Oberbayern München, Kreisfreie Stadt
Activity type
Research Organisations
Non-EU contribution
€ 0,00
LPKF LASER & ELECTRONICS AG
Germany
Net EU contribution
€ 550 000,00
Address
Osteriede 7
30827 Garbsen

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Region
Niedersachsen Hannover Region Hannover
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 0,00
FICONTEC IRELAND LIMITED
Ireland
Net EU contribution
€ 822 375,00
Address
Tyndall National Institute, Lee Maltings Complex, Dyke Parade
T12 R5CP Cork

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Region
Ireland Southern South-West
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 0,00
SUSS MICROOPTICS SA
Switzerland
Net EU contribution
€ 486 750,00
Address
Rouges Terres 61
2068 Hauterive

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Region
Schweiz/Suisse/Svizzera Espace Mittelland Neuchâtel
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 0,00
ROBERT BOSCH GMBH
Germany
Net EU contribution
€ 280 000,00
Address
Robert-bosch-platz 1
70839 Gerlingen-schillerhoehe

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Region
Baden-Württemberg Stuttgart Ludwigsburg
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 0,00
TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands
Net EU contribution
€ 549 841,25
Address
Groene Loper 3
5612 AE Eindhoven

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Region
Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Higher or Secondary Education Establishments
Non-EU contribution
€ 0,00
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
Net EU contribution
€ 575 780,00
Address
Kapeldreef 75
3001 Leuven

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Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Research Organisations
Non-EU contribution
€ 0,00