Objective
Micro-bolometer sensors are compact, light, low power, reliable and affordable infrared imaging components. They are ahead of the cooled infrared sensors for these criteria but lag behind them in terms of performance:
- Existing micro-bolometer technologies have thermal time constants around 10 msec. This is more than 10 times that of cooled detectors.
- Moreover, there is no multispectral micro-bolometer sensor available today for applications such as absolute thermography and optical gas imaging.
BRIGHTER will develop 2 new classes of micro-bolometer solutions to reduce the performance gap with their cooled counterparts:
- Fast thermal micro-bolometer imaging solutions with time constant in the 2.5 to 5 msec range, that is to say 2 to 4 times faster than that of today’s micro-bolometer technologies. Read out integrated circuits able to operate up to 500 frames per seconds will also be investigated.
- Multi-spectral micro-bolometer solutions with at least access at the pixel level to 2 different wavelengths in the range 7 to 12 µm.
The developments will focus on pixel technology, Read Out Integrated Circuit, low power edge image signal processing electronic, optics, and image treatment algorithms. All stakeholders of the value chain are involved: academics, RTO, micro-bolometer manufacturer, algorithm developers, camera integrators and end users. They will collaborate to define the best trade-offs for all use-cases.
The 2 new classes of products that will spring from BRIGHTER will generate concrete benefits. They will make it possible to save on material and energy in the manufacturing sector, perform efficient and affordable monitoring of infrastructures and trains, contribute to autonomous vehicles sensor suite, decrease the road casualties among Vulnerable Road Users, better control gas emission in cities and industrial areas. These new usages served by the European industry will allow Europe to increase its market share in the infrared imaging industry.
Fields of science
- engineering and technologymechanical engineeringvehicle engineeringautomotive engineeringautonomous vehicles
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensors
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsignal processing
- natural sciencesphysical sciencesoptics
Programme(s)
Funding Scheme
RIA - Research and Innovation action
Coordinator
91120 Palaiseau
France
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Participants (15)
34445 Istanbul
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81040 Istanbul
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77454 Marne-la-vallee
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
78153 Le Chesnay Cedex
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1140 Bruxelles
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
3001 Leuven
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
75015 Paris 15
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69650 Saint Germain Au Mont D Or
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
92600 Asnieres
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1000 029 Lisboa
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13013 Marseille
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1400 038 Lisboa
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34722 Istanbul
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
28918 Leganes
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
75794 Paris
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