Project description
3D integration with Te-based transistors to overcome silicon integrated circuit limits
As silicon reaches its physical limits, improving integrated circuits by shrinking transistor sizes, as dictated by Moore’s law, becomes significantly more challenging. Monolithic 3D integration offers a solution by stacking transistors without damaging the underlying layers. 2D semiconductors show promise for these stacked transistors, especially n-type devices. However, p-type devices lag behind owing to high contact resistance and Schottky barriers with wide bandgap 2D semiconductors. Tellurium (Te) shows potential for p-type transistors, offering better valence band access and performance. Funded by the Marie Sklodowska-Curie Actions programme, the BEOLTPT project aims to advance Te-based p-type devices, focusing on Van der Waals contacts, CMOS logic circuit performance and monolithic 3D integration prospects.
Objective
The performance enhancement of integrated circuits relying on the downscaling of transistor dimensions following Moore’s law is becoming more and more challenging as silicon is reaching its physical limit. Thus, monolithic 3D integration has been considered as a powerful method to improve system performance further.
This requires that transistors be stacked on top of each other at back-end-of-line (BEOL) compatible temperatures to avoid degradation of underlying devices. Two-dimensional (2D) semiconductors are promising candidates for such BEOL transistors but most advancements in terms of device performance and reliable BEOL integration concern n-type devices, while p-type is still lagging behind. Hence, better p-type BEOL transistors are highly sought after to enable complementary metal oxide semiconductor (CMOS) technology. One of several challenges for p-type devices is contact resistance because wide band gap 2D semiconductors typically have large Schottky barriers between the metal contact and their valence band. Tellurium (Te) and its compounds have recently been identified as promising candidates for BEOL p-type 2D transistors, which offer decent access to their valence bands, integration at BEOL-compatible temperatures, and good material prospects for device performance. However, research on such devices is still in its infancy, and drive current, stability (passivation), and contact resistance still need improvements. Thus, in this work, we propose to advance the research in Te-based p-type devices. In particular, we will experimentally explore the potential of 2D material van der Waals contacts. Furthermore, we will evaluate the CMOS logic circuit performance coupling with its n-type counterpart and the prospects of our devices for monolithic 3D integration through simulation.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
This project's classification has been human-validated.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
This project's classification has been human-validated.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering
- engineering and technology nanotechnology nano-materials two-dimensional nanostructures
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- natural sciences chemical sciences inorganic chemistry metalloids
Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.1.2 - Marie Skłodowska-Curie Actions (MSCA)
MAIN PROGRAMME
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-TMA-MSCA-PF-EF - HORIZON TMA MSCA Postdoctoral Fellowships - European Fellowships
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-MSCA-2023-PF-01
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
70174 Stuttgart
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.