Objective - To evaluate performance and cost benefits of the new metalisation technology over the tungsten plug/ aluminium process.- To evaluate the sputter etch - Ti/TiN processes which precede the aluminium deposition and the FORCEFILL process.- To assess and improve the overall equipment performance in a high volume 0.5 micron BICMOS production lineThe performance of the Electrotech SIGMA 204 FORCEFILL cluster tool is to be assessed for 0.5 micron contact/via plug technology (Al/0.5%Cu) in the high volume production environment of Texas Instruments, Freising Germany. The advantages of this aluminium FORCEFILL technology over the presently employed tungsten plug and aluminium process has to be demonstrated under manufacturing conditions. The complete metalisation process sequence is: Sputter etch - Ti/TiN - Al/0.5%Cu - FORCEFILL. Fields of science natural scienceschemical sciencesinorganic chemistrytransition metalsnatural scienceschemical sciencesinorganic chemistrypost-transition metals Programme(s) FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998 Topic(s) 2.9 - Building blocks, methods & tools for semiconductor app&techs Call for proposal Data not available Funding Scheme ACM - Preparatory, accompanying and support measures Coordinator Texas Instruments Deutschland Gmbh EU contribution No data Address Haggertystrasse 1 85356 Freising Germany See on map Total cost No data
