Sigma 204 force fill assessment for 0.5 microns contact/via al(0.5 %cu) plug technology in high volume production environment

Cel

- To evaluate performance and cost benefits of the new metalisation technology over the tungsten plug/ aluminium process.

- To evaluate the sputter etch - Ti/TiN processes which precede the aluminium deposition and the FORCEFILL process.

- To assess and improve the overall equipment performance in a high volume 0.5 micron BICMOS production line

The performance of the Electrotech SIGMA 204 FORCEFILL cluster tool is to be assessed for 0.5 micron contact/via plug technology (Al/0.5%Cu) in the high volume production environment of Texas Instruments, Freising Germany. The advantages of this aluminium FORCEFILL technology over the presently employed tungsten plug and aluminium process has to be demonstrated under manufacturing conditions. The complete metalisation process sequence is: Sputter etch - Ti/TiN - Al/0.5%Cu - FORCEFILL.

Dziedzina nauki

Program(-y)

FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998

Temat(-y)

2.9 - Building blocks, methods & tools for semiconductor app&techs

Zaproszenie do składania wniosków

Data not available

System finansowania

ACM - Preparatory, accompanying and support measures

Koordynator

Texas Instruments Deutschland Gmbh

Wkład UE

Brak danych

Adres

Haggertystrasse 1
85356 Freising
Niemcy

Koszt całkowity