Sigma 204 force fill assessment for 0.5 microns contact/via al(0.5 %cu) plug technology in high volume production environment

Obiettivo

- To evaluate performance and cost benefits of the new metalisation technology over the tungsten plug/ aluminium process.

- To evaluate the sputter etch - Ti/TiN processes which precede the aluminium deposition and the FORCEFILL process.

- To assess and improve the overall equipment performance in a high volume 0.5 micron BICMOS production line

The performance of the Electrotech SIGMA 204 FORCEFILL cluster tool is to be assessed for 0.5 micron contact/via plug technology (Al/0.5%Cu) in the high volume production environment of Texas Instruments, Freising Germany. The advantages of this aluminium FORCEFILL technology over the presently employed tungsten plug and aluminium process has to be demonstrated under manufacturing conditions. The complete metalisation process sequence is: Sputter etch - Ti/TiN - Al/0.5%Cu - FORCEFILL.

Campo scientifico

Programma(i)

FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998

Argomento(i)

2.9 - Building blocks, methods & tools for semiconductor app&techs

Invito a presentare proposte

Data not available

Meccanismo di finanziamento

ACM - Preparatory, accompanying and support measures

Coordinatore

Texas Instruments Deutschland Gmbh

Contributo UE

Nessun dato

Indirizzo

Haggertystrasse 1
85356 Freising
Germania

Costo totale