Ziel
The purpose of the project was to develop the essential mask and reticle technology required for advanced high-density and fast turn-round ASIC requirements to a device complexity level equivalent to 16 MDRAM. The results include new materials, processes and equipment which will make a significant contribution to the ability of the European semiconductor industry to manufacture advanced devices.
The purpose of the project is to develop the essential mask and reticle technology required for advanced high density and fast turnaround application specific integrated circuit (ASIC) requirements to a device complexity level equivalent to 16 million dynamic random access memories (MDRAM).
Software has been created allowing input data to be processed to order level status without human intervention. High speed data transfer and processing techniques have been implemented, greatly improving work efficiency and data integrity. Key blocks for a modular computer aided manufacture (CAM) system have been created and implemented, aiming for efficient, automated manufacturing control.
Available chrome substrate sources have been evaluated on a world scale to determine the optimum supply for quality and performance. Technology has been developed to reduce charge accumulation during electron beam pattern generation. Surface treatments have been developed to eliminate pinholes and reduce other levels of imperfection. New materials have been identified and are being spin coated to replace standard phosphate buffered sucrose (PBS) based electron beam resist, with its inherent limitations.
Analysis of far field scattering from small particles (down to 0.3 micron) has been completed. A novel dark field detector system has been designed and a patent application submitted (prototype being evaluated). Particle detector performance measurement techniques have been developed, including design of a suitable test structure, Performance of prototype system is being compared against other commercially available systems (in terms of speed and accuracy).
Methods have been developed for mixing and filtering polymers suitable for g-line, i-line and deep ultraviolet (UV) pellicles. European pellicle manufacturing capability has been established for both broad and narrow spectral range pellicles. Pellicles have been fabricated from novel materials and are now being evaluated to determine op timum performance. Frame adhesives and hermiticity of the cavity have been determined to be the critical performance issue.
Factors determing the effectiveness of the cleaning process have been identified. An improved fully automatic European mask plate cleaner has been installed at two sites. Sources of contamination, including cleaning chemistry residues such as long term crystal growth, have been identified. Development of the optimum cleaning process chemistry (ie economy and effectiveness) continue.
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KY7 4NT Glenrothes
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