Objective
The current integrated circuit scaling hits two major roadblocks or walls. One wall is the atomic level feature sizes of the current devices forcing the capabilities of even nano-scale implementations. The other wall is the total power consumed per unit area exceeding the capabilities thermal dissipation techniques limiting the maximum device densities. The solution to the feature size problem is scaling in the orthogonal direction to the conventional device plane - the 3D integration. The solution to the power problem is the use of ultra low power design approaches. However, the 3D integration increases the thermal dissipation problem and ultra low power design can not provide total performance due to low clock speeds unless extremely large number of devices is combined in small areas. We propose a unique combination of ultra low power design approaches and 3D integration to provide an optimal performance to the user. Low power design eliminates the thermal dissipation problem of the 3D integration whereas 3D integration enables dense device integration in small volumes to solve the space-time trade-off in ultra low power design approaches. The result will be a vertically integrated circuit with power efficiencies several hundred times better than current dedicated processors.
Fields of science (EuroSciVoc)
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-PEOPLE-2010-RG
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
34956 Istanbul
Türkiye
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.