High-performance microprocessors
Vertical stacking of dies, forming a 3D IC, extends Moore's law and enables a new generation of tiny but powerful devices. However, because of their high power density, inadequate thermal dissipation becomes a major concern. The EU-funded project 'Ultra low energy vertically integrated circuits' (ULEVIS) proposed a unique combination of ultra-low–power 3D ICs to provide optimal microprocessor performances. On the one hand, low-power architecture overcomes thermal management issues. On the other hand, 3D ICs enable dense device integration in small volumes to solve the space–time trade-off in the former case. The outcome is a vertically integrated circuit with power efficiencies significantly exceeding those of current dedicated processors. Project work demonstrated that there is a critical need to have a low-temperature design at device layer to benefit from 3D integrated systems. It also highlighted a new application field in neuromorphic computing. The project team joined a research initiative in which electronic components of a few tenths of watts were used to model the human brain. Project findings gained exposure and allowed the team to be invited to join several project proposals in Europe.