High-performance microprocessors
Vertical stacking of dies, forming a 3D IC, extends Moore's law and enables a new generation of tiny but powerful devices. However, because of their high power density, inadequate thermal dissipation becomes a major concern. The EU-funded project 'Ultra low energy vertically integrated circuits' (ULEVIS) proposed a unique combination of ultra-low–power 3D ICs to provide optimal microprocessor performances. On the one hand, low-power architecture overcomes thermal management issues. On the other hand, 3D ICs enable dense device integration in small volumes to solve the space–time trade-off in the former case. The outcome is a vertically integrated circuit with power efficiencies significantly exceeding those of current dedicated processors. Project work demonstrated that there is a critical need to have a low-temperature design at device layer to benefit from 3D integrated systems. It also highlighted a new application field in neuromorphic computing. The project team joined a research initiative in which electronic components of a few tenths of watts were used to model the human brain. Project findings gained exposure and allowed the team to be invited to join several project proposals in Europe.
Keywords
High-performance microprocessor, integrated circuit, Moore's law, power density, thermal dissipation, vertically integrated circuit, low-power architecture, thermal management, device integration, neuromorphic computing
