Project description
Novel 3D stacking technology to extend Moore’s law
Moore’s law, which states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months, has guided transistor design for more than 50 years. However, the continuous shrink of silicon chips approaches physical limits. Novel packaging architectures such as 3D integration, the vertical chip integration, has long held promise for increasing the transistor count. The ORIGENAL project will take a radically new approach to address ultra-dense 3D integration of chips. At the core of ORIGENAL’s 3D packaging concept is a thin-film transistor technology built on a thin foil substrate. The proposed architecture allows the stacking of thousands of layers on top of each other, permitting further miniaturisation for another 30 years.
Objective
Increasing the integrated circuits complexity by lateral scaling, known as Moore’s law, was the major driving force for the semiconductor industry. Now, after more than 4 decades down scaling is approaching fundamental and also economic limitations, and new solutions for further increasing the transistor count are explored. Utilizing the third dimension in chip architecture is one of the most promising directions. However, current solutions like wafer-to-wafer stacking will only deliver solutions for the short term with maximum some tens of layers on-top of each other’s.
In the ORIGENAL project we propose a radically new approach to address the challenge of ultra-dense 3D integration of CMOS devices by using a thin-film-transistor (TFT) technology on thin foil substrate and the subsequent topological folding in order to achieve a dense 3D packaging with completely new integration architectures. This radically new approach will enable the stacking of thousands of layers on top of each other’s, each containing state-of-the-art CMOS circuits and thus will provide enough fuel to further increase the transistor count on a chip according to Moore’s law for more than 30 years. In addition, new computing concepts like neuromorphic computing will significantly benefit from the highly interconnected architecture developed in this project.
The proposal focuses on the development of a suitable thin-film-transistor technology on ultrathin-foil, the 3D interconnect and architecture, and the required technology for high precision folding. Achieving the ambitious objectives requires an interdisciplinary approach including contributions from Material science, electrical engineering, mechanical engineering, biology, physics and chemistry.
The proposed forefront research will not only lay the foundations for a new line of technology, but also open up an opportunity to reinforce the technological leadership of European players.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- engineering and technology mechanical engineering
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- engineering and technology electrical engineering, electronic engineering, information engineering electrical engineering
- engineering and technology environmental engineering energy and fuels
- social sciences law
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.1.2. - EXCELLENT SCIENCE - Future and Emerging Technologies (FET)
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H2020-EU.1.2.1. - FET Open
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
RIA - Research and Innovation action
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-FETOPEN-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
42119 Wuppertal
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.