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Origami electronics for three dimensional integration of computational devices

Project description

Novel 3D stacking technology to extend Moore’s law

Field of science

  • /social sciences/law
  • /engineering and technology/mechanical engineering
  • /engineering and technology/electrical engineering, electronic engineering, information engineering/electrical engineering

Call for proposal

H2020-FETOPEN-2018-2019-2020-01
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

BERGISCHE UNIVERSITAET WUPPERTAL
Address
Gauss-strasse 20
42119 Wuppertal
Germany
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 334 132,50

Participants (4)

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Finland
EU contribution
€ 960 001,25
Address
Tekniikantie 21
02150 Espoo
Activity type
Research Organisations
UNIVERSITA DI PISA
Italy
EU contribution
€ 435 285
Address
Lungarno Pacinotti 43/44
56126 Pisa
Activity type
Higher or Secondary Education Establishments
TECHNISCHE UNIVERSITAET WIEN
Austria
EU contribution
€ 631 159,25
Address
Karlsplatz 13
1040 Wien
Activity type
Higher or Secondary Education Establishments
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germany
EU contribution
€ 383 222,50
Address
Otto Blumenthal Strasse
52074 Aachen
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)