Project description DEENESFRITPL Novel 3D stacking technology to extend Moore’s law Moore’s law, which states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months, has guided transistor design for more than 50 years. However, the continuous shrink of silicon chips approaches physical limits. Novel packaging architectures such as 3D integration, the vertical chip integration, has long held promise for increasing the transistor count. The ORIGENAL project will take a radically new approach to address ultra-dense 3D integration of chips. At the core of ORIGENAL’s 3D packaging concept is a thin-film transistor technology built on a thin foil substrate. The proposed architecture allows the stacking of thousands of layers on top of each other, permitting further miniaturisation for another 30 years. Show the project objective Hide the project objective Objective Increasing the integrated circuits complexity by lateral scaling, known as Moore’s law, was the major driving force for the semiconductor industry. Now, after more than 4 decades down scaling is approaching fundamental and also economic limitations, and new solutions for further increasing the transistor count are explored. Utilizing the third dimension in chip architecture is one of the most promising directions. However, current solutions like wafer-to-wafer stacking will only deliver solutions for the short term with maximum some tens of layers on-top of each other’s. In the ORIGENAL project we propose a radically new approach to address the challenge of ultra-dense 3D integration of CMOS devices by using a thin-film-transistor (TFT) technology on thin foil substrate and the subsequent topological folding in order to achieve a dense 3D packaging with completely new integration architectures. This radically new approach will enable the stacking of thousands of layers on top of each other’s, each containing state-of-the-art CMOS circuits and thus will provide enough fuel to further increase the transistor count on a chip according to Moore’s law for more than 30 years. In addition, new computing concepts like neuromorphic computing will significantly benefit from the highly interconnected architecture developed in this project.The proposal focuses on the development of a suitable thin-film-transistor technology on ultrathin-foil, the 3D interconnect and architecture, and the required technology for high precision folding. Achieving the ambitious objectives requires an interdisciplinary approach including contributions from Material science, electrical engineering, mechanical engineering, biology, physics and chemistry.The proposed forefront research will not only lay the foundations for a new line of technology, but also open up an opportunity to reinforce the technological leadership of European players. Fields of science engineering and technologymechanical engineeringnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivityengineering and technologyelectrical engineering, electronic engineering, information engineeringelectrical engineeringengineering and technologyenvironmental engineeringenergy and fuelssocial scienceslaw Programme(s) H2020-EU.1.2. - EXCELLENT SCIENCE - Future and Emerging Technologies (FET) Main Programme H2020-EU.1.2.1. - FET Open Topic(s) FETOPEN-01-2018-2019-2020 - FET-Open Challenging Current Thinking Call for proposal H2020-FETOPEN-2018-2020 See other projects for this call Sub call H2020-FETOPEN-2018-2019-2020-01 Funding Scheme RIA - Research and Innovation action Coordinator BERGISCHE UNIVERSITAET WUPPERTAL Net EU contribution € 334 132,50 Address Gauss-strasse 20 42119 Wuppertal Germany See on map Region Nordrhein-Westfalen Düsseldorf Wuppertal, Kreisfreie Stadt Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 0,00 Participants (4) Sort alphabetically Sort by Net EU contribution Expand all Collapse all TEKNOLOGIAN TUTKIMUSKESKUS VTT OY Finland Net EU contribution € 960 001,25 Address Tekniikantie 21 02150 Espoo See on map Region Manner-Suomi Helsinki-Uusimaa Helsinki-Uusimaa Activity type Research Organisations Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 0,00 UNIVERSITA DI PISA Italy Net EU contribution € 435 285,00 Address Lungarno pacinotti 43/44 56126 Pisa See on map Region Centro (IT) Toscana Pisa Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 0,00 TECHNISCHE UNIVERSITAET WIEN Austria Net EU contribution € 631 159,25 Address Karlsplatz 13 1040 Wien See on map Region Ostösterreich Wien Wien Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 0,00 GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH Germany Net EU contribution € 383 222,50 Address Otto blumenthal strasse 52074 Aachen See on map SME The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed. Yes Region Nordrhein-Westfalen Köln Städteregion Aachen Activity type Other Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 0,00
