Origami electronics for three dimensional integration of computational devices

Project description

Novel 3D stacking technology to extend Moore’s law

Fields of science

• social sciences › law
• engineering and technology › mechanical engineering
• engineering and technology › electrical engineering, electronic engineering, information engineering › electrical engineering

Programme(s)

• H2020-EU.1.2. - EXCELLENT SCIENCE - Future and Emerging Technologies (FET)
• H2020-EU.1.2.1. - FET Open

Topic(s)

• FETOPEN-01-2018-2019-2020 - FET-Open Challenging Current Thinking

Call for proposal

H2020-FETOPEN-2018-2019-2020-01
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

BERGISCHE UNIVERSITAET WUPPERTAL

Address

Gauss-strasse 20
42119 Wuppertal
Germany

Activity type

Higher or Secondary Education Establishments

EU contribution

€ 334 132,50

Participants (4)

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Finland

EU contribution

€ 960 001,25

Address

Tekniikantie 21
02150 Espoo

Activity type

Research Organisations

UNIVERSITA DI PISA

Italy

EU contribution

€ 435 285

Address

Lungarno Pacinotti 43/44
56126 Pisa

Activity type

Higher or Secondary Education Establishments

TECHNISCHE UNIVERSITAET WIEN

Austria

EU contribution

€ 631 159,25

Address

Karlsplatz 13
1040 Wien

Activity type

Higher or Secondary Education Establishments

GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH

Germany

EU contribution

€ 383 222,50

Address

Otto Blumenthal Strasse
52074 Aachen

Activity type

Other