Project description
Technologies and devices for micro/nano-scale integration
The DAVID project targets to provide an extremely high packaging density for hybrid integration of MEMS with ASICs. A significant reduction of assembly and packaging costs, specifically for consumer applications, shall be reached by the integration approach itself, but also by a lithographic size reduction of micromachined structures. The benefit becomes most visible when several sensors are clustered in a single, hermetic encapsulation on wafer level.
Beyond this, a "3D-SiP" approach can improve product quality by reducing parasitic effects: DAVID's extremely short interconnects are particularly interesting for capacitive or high-frequency signals.
The project is designed to demonstrate a complete process flow with the following technology components: - vertical interconnect by post-CMOS feedthroughs- handling, assembly and waferlevel bonding of singulated, open MEMS devices on a CMOS wafer- vacuum sealing and fine structured getter films to control the sensor cavity ambient- waferlevel molding and solder balling to build a chip-scale MEMS-SiP.
Critical aspect like mechanical drift and offset effects of package stress are addressed by the implementation of a test vehicle that allows to measure and correlate them with FEM simulations. A control of design and material suitability is therefore given through all process stages.
The project consortium forms a representative industrial environment: ST Microelectronics as a large semiconductor manufacturer acts close to high-volume market requirements. Datacon Technology and Besi Molding provide industrial equipment for assembly and packaging. SAES Getters is a renowned service provider in vacuum technology. Research and design support is given by Fraunhofer ISIT and Wroclaw University of Technology.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- natural sciences physical sciences electromagnetism and electronics microelectronics
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP6-2004-IST-4
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Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
25524 Itzehoe
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.