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Surface Acoustic Waves Stimulated Brillouin Scattering

Project description

Photonics, electronics and now acoustics functionalities integrated on a single chip

Photonic integrated circuits (PICs) are revolutionising applications in optics and optoelectronics, integrating numerous photonic devices on a single chip for enhanced performance, lower energy consumption and scalability. Stimulated Brillouin scattering (SBS), an interaction between an intense beam of photons and an acoustic wave in a material, has had a profound influence in recent decades on fibre optic communications and fibre optic sensing. The EU-funded SAW-SBS project will pave the road to implementation of SBS on PICs, extending silicon photonics to the realm of acoustics and mass production supporting new device capabilities.

Objective

Stimulated interactions between light and hypersonic elastic waves, known as stimulated Brillouin scattering (SBS), provide opportunities far beyond what is possible using light alone: From basic research of light-matter interactions and quantum mechanics, to ultra-narrow laser sources, spectroscopy, communication, signal processing and sensors. The realization of SBS in photonic integrated platforms provides large freedom of design, and would support mass production. The objectives of the proposed research program are to reveal, investigate and employ SBS processes on the most technologically-significant integration platform: silicon-on-insulator (SOI). Such interactions are largely considered out of reach. The silicon device layer of SOI does not guide acoustic modes, which leak away to the underlying bulk. Previous studies of SBS in silicon relied on suspended membranes and waveguides, in which the underlying silicon dioxide layer has been etched away. Suspended devices become fragile, and their subsequent processing is difficult. In addition, SBS in silicon has been restricted to the forward direction only. Forward scattering interactions are inherently difficult to localize.
To overcome this challenge, I propose to rely on surface acoustic waves (SAWs) that are guided by the upper interface between the solid substrate and the air above. The propagation of SAWs is supported by SOI, however they were not yet considered towards SBS in this platform before. Backwards SBS will be realised between guided light in a standard SOI waveguide, with an underlying oxide layer, and a surface acoustic mode. Analysis shows that the effect should be strong enough to be observed, and also employed in signal processing and sensing applications. Additional objectives include SAW-photonic chips with tuneable acoustic frequency and SAW spectroscopy on-chip. The program outcomes could add another dimension to standard silicon-photonics, that of acoustics.

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Topic(s)

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Funding Scheme

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ERC-COG - Consolidator Grant

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Call for proposal

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(opens in new window) ERC-2020-COG

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Host institution

TECHNION - ISRAEL INSTITUTE OF TECHNOLOGY
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 945 885,05
Address
SENATE BUILDING TECHNION CITY
32000 Haifa
Israel

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Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 945 885,05

Beneficiaries (2)

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