FLEXible phased array system for sat-COM applications

Project Information

FLEXCOM

Grant agreement ID: 101004233

DOI 10.3030/101004233

Project closed

EC signature date 3 November 2020

Start date 1 December 2020

End date 31 May 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Total cost € 2 892 187,50

EU contribution € 2 892 187,50

Coordinated by

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI
Italy

Deliverables

Documents, reports (1)

Multi-purpose K/Ka SatCom antenna tile applications

This report describes the applications targeted by the present projects In particular this report will give emphasis to the different applicative scenarios including both space and airborne applications where the high modularity of the proposed system and the high compactness resulting from the singleaperture dualband aperture approach

Publications

Peer reviewed articles (3)

Electronically Steerable Antennas for Future Heterogeneous Communication Networks: Review and Perspectives

Author(s): T. Chaloun, L. Boccia, E. Arnieri, M. Fischer, V. Valenta, N.J.G. Fonseca, C. Waldschmidt
Published in: IEEE Journal of Microwaves (Vol. 2, Issue 4, October 2022) (Invited Paper), 2022, ISSN 2692-8388
Publisher: IEEE
DOI: 10.1109/jmw.2022.3202626

Characterization and optimization of the heat dissipation capability of a chip-on-board package using finite element methods

Author(s): Z. Cao, M. Stocchi, M. Wietstruck, T. Mausolf, C. Carta and M. Kaynak
Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, ISSN 2156-3985
Publisher: IEEE
DOI: 10.1109/tcpmt.2023.3259199

Low-Profile Dual-Band Dual-Polarized Transmitarray Antenna Based on Multilayer Frequency Selective Surfaces

Author(s): R. De Marco, E. Arnieri, F. Greco, A. Bordbar, G. Amendola and L. Boccia
Published in: IEEE Transactions on Antennas and Propagation, 2023, Page(s) 7354 - 7362, ISSN 0018-926X
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tap.2023.3296257

Conference proceedings (8)

Low Profile Dual-Band Dual-Polarized Transmitarray Antenna for Satellite Communications

Author(s): Raffaele De Marco, Luigi Boccia, Giandomenico Amendola, Emilio Arnieri, Francesco Greco, Arman Bordbar
Published in: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Page(s) 4, ISBN 978-1-6654-7541-9
Publisher: IEEE
DOI: 10.23919/eucap57121.2023.10133627

Preliminary Results on a Compact Duplexer Design for K/Ka-Band SatCom on the Move User Terminals

Author(s): C. Mustacchio, T. Chaloun, M. Fischer, E. Arnieri, G. Amendola and L. Boccia
Published in: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Publisher: IEEE
DOI: 10.1109/mms55062.2022.9825497

SiGe BiCMOS building blocks for a K/Ka-band flexible phasedarray system for SatCom applications

Author(s): A. Colzani, M. Fumagalli and A. Fonte
Published in: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Publisher: IEEE
DOI: 10.1109/mms55062.2022.9825538

20 GHz LNA and 29 GHz PA on SiGe BiCMOS technology for SatCom phased array systems

Author(s): M. Fumagalli, A. Colzani, A. Fonte
Published in: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Page(s) 4
Publisher: IEEE
DOI: 10.23919/eumic54520.2022.9923435

Wide-Angle Scanning Coupled Dipole Antenna Array for Heterogeneous mm-Wave Comunication Networks

Author(s): M.Fischer, C. Waldschmidt, T. Chaloun
Published in: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Page(s) 4, ISBN 978-1-6654-7541-9
Publisher: IEEE
DOI: 10.23919/eucap57121.2023.10133501

An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package

Author(s): Z. Cao, B. Heusdens, A. Ziaei and M. Kaynak
Published in: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Page(s) 4
Publisher: IEEE
DOI: 10.23919/eumic54520.2022.9923481

The Wafer-Level Package Integration of a K/ Ka Band Diplexer-on-PCB

Author(s): Z. Cao, M. Stocchi, M. Wietstruck and M. Kaynak
Published in: IEEE MTT-S International Microwave Filter Workshop (IMFW), 2021
Publisher: IEEE

An advanced finite element model of the Cu pillar solder reflow assembly

Author(s): Z. Cao, B. Pekkolay, A. Okur, B. Heusdens, C. Carta, M. Kaynak
Published in: 24th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Publisher: IEEE
DOI: 10.1109/eurosime56861.2023.10100808