FLEXible phased array system for sat-COM applications

Risultati finali

Multi-purpose K/Ka SatCom antenna tile applications

This report describes the applications targeted by the present projects In particular this report will give emphasis to the different applicative scenarios including both space and airborne applications where the high modularity of the proposed system and the high compactness resulting from the singleaperture dualband aperture approach

Pubblicazioni

Electronically Steerable Antennas for Future Heterogeneous Communication Networks: Review and Perspectives

Autori: T. Chaloun, L. Boccia, E. Arnieri, M. Fischer, V. Valenta, N.J.G. Fonseca, C. Waldschmidt
Pubblicato in: IEEE Journal of Microwaves (Vol. 2, Numero 4, October 2022) (Invited Paper), 2022, ISSN 2692-8388
Editore: IEEE
DOI: 10.1109/jmw.2022.3202626

Characterization and optimization of the heat dissipation capability of a chip-on-board package using finite element methods

Autori: Z. Cao, M. Stocchi, M. Wietstruck, T. Mausolf, C. Carta and M. Kaynak
Pubblicato in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, ISSN 2156-3985
Editore: IEEE
DOI: 10.1109/tcpmt.2023.3259199

Low-Profile Dual-Band Dual-Polarized Transmitarray Antenna Based on Multilayer Frequency Selective Surfaces

Autori: R. De Marco, E. Arnieri, F. Greco, A. Bordbar, G. Amendola and L. Boccia
Pubblicato in: IEEE Transactions on Antennas and Propagation, 2023, Pagina/e 7354 - 7362, ISSN 0018-926X
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tap.2023.3296257

Low Profile Dual-Band Dual-Polarized Transmitarray Antenna for Satellite Communications

Autori: Raffaele De Marco, Luigi Boccia, Giandomenico Amendola, Emilio Arnieri, Francesco Greco, Arman Bordbar
Pubblicato in: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Pagina/e 4, ISBN 978-1-6654-7541-9
Editore: IEEE
DOI: 10.23919/eucap57121.2023.10133627

Preliminary Results on a Compact Duplexer Design for K/Ka-Band SatCom on the Move User Terminals

Autori: C. Mustacchio, T. Chaloun, M. Fischer, E. Arnieri, G. Amendola and L. Boccia
Pubblicato in: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Editore: IEEE
DOI: 10.1109/mms55062.2022.9825497

SiGe BiCMOS building blocks for a K/Ka-band flexible phasedarray system for SatCom applications

Autori: A. Colzani, M. Fumagalli and A. Fonte
Pubblicato in: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Editore: IEEE
DOI: 10.1109/mms55062.2022.9825538

20 GHz LNA and 29 GHz PA on SiGe BiCMOS technology for SatCom phased array systems

Autori: M. Fumagalli, A. Colzani, A. Fonte
Pubblicato in: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Pagina/e 4
Editore: IEEE
DOI: 10.23919/eumic54520.2022.9923435

Wide-Angle Scanning Coupled Dipole Antenna Array for Heterogeneous mm-Wave Comunication Networks

Autori: M.Fischer, C. Waldschmidt, T. Chaloun
Pubblicato in: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Pagina/e 4, ISBN 978-1-6654-7541-9
Editore: IEEE
DOI: 10.23919/eucap57121.2023.10133501

An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package

Autori: Z. Cao, B. Heusdens, A. Ziaei and M. Kaynak
Pubblicato in: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Pagina/e 4
Editore: IEEE
DOI: 10.23919/eumic54520.2022.9923481

The Wafer-Level Package Integration of a K/ Ka Band Diplexer-on-PCB

Autori: Z. Cao, M. Stocchi, M. Wietstruck and M. Kaynak
Pubblicato in: IEEE MTT-S International Microwave Filter Workshop (IMFW), 2021
Editore: IEEE

An advanced finite element model of the Cu pillar solder reflow assembly

Autori: Z. Cao, B. Pekkolay, A. Okur, B. Heusdens, C. Carta, M. Kaynak
Pubblicato in: 24th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editore: IEEE
DOI: 10.1109/eurosime56861.2023.10100808

Risultati finali

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