FLEXible phased array system for sat-COM applications

Información del proyecto

FLEXCOM

Identificador del acuerdo de subvención: 101004233

DOI

10.3030/101004233

Proyecto cerrado

Fecha de la firma de la CE 3 Noviembre 2020

Fecha de inicio 1 Diciembre 2020

Fecha de finalización 31 Mayo 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Coste total

€ 2 892 187,50

Aportación de la UE

€ 2 892 187,50

Coordinado por

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI
Italy

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (1)

Multi-purpose K/Ka SatCom antenna tile applications

This report describes the applications targeted by the present projects In particular this report will give emphasis to the different applicative scenarios including both space and airborne applications where the high modularity of the proposed system and the high compactness resulting from the singleaperture dualband aperture approach

Publicaciones

Peer reviewed articles (5)

Electronically Steerable Antennas for Future Heterogeneous Communication Networks: Review and Perspectives

Autores: T. Chaloun, L. Boccia, E. Arnieri, M. Fischer, V. Valenta, N.J.G. Fonseca, C. Waldschmidt
Publicado en: IEEE Journal of Microwaves (Vol. 2, Edición 4, October 2022) (Invited Paper), 2022, ISSN 2692-8388
Editor: IEEE
DOI: 10.1109/jmw.2022.3202626

Characterization and optimization of the heat dissipation capability of a chip-on-board package using finite element methods

Autores: Z. Cao, M. Stocchi, M. Wietstruck, T. Mausolf, C. Carta and M. Kaynak
Publicado en: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, ISSN 2156-3985
Editor: IEEE
DOI: 10.1109/tcpmt.2023.3259199

Low-Profile Dual-Band Dual-Polarized Transmitarray Antenna Based on Multilayer Frequency Selective Surfaces

Autores: R. De Marco, E. Arnieri, F. Greco, A. Bordbar, G. Amendola and L. Boccia
Publicado en: IEEE Transactions on Antennas and Propagation, 2023, Página(s) 7354 - 7362, ISSN 0018-926X
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tap.2023.3296257

Low-Profile Dual-Band Dual-Polarized Transmitarray Antenna Based on Multilayer Frequency Selective Surfaces

Autores: Raffaele De Marco, Emilio Arnieri, Francesco Greco, Arman Bordbar, Giandomenico Amendola, Luigi Boccia
Publicado en: IEEE Transactions on Antennas and Propagation, Edición 71, 2024, Página(s) 7354-7362, ISSN 0018-926X
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tap.2023.3296257

Vertical Waveguide-to-Microstrip Self-Diplexing Transition for Dual-Band Applications

Autores: Emilio Arnieri, Francesco Greco, Luigi Boccia, Giandomenico Amendola
Publicado en: IEEE Microwave and Wireless Components Letters, Edición 32, 2022, Página(s) 1407-1410, ISSN 1531-1309
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/lmwc.2022.3193166

Conference proceedings (11)

SiGe BiCMOS building blocks for a K/Ka-band flexible phased array system for SatCom applications

Autores: Alberto Colzani, Matteo Fumagalli, Alessandro Fonte
Publicado en: 2022 Microwave Mediterranean Symposium (MMS), Edición 1, 2022, Página(s) 1-5
Editor: IEEE
DOI: 10.1109/mms55062.2022.9825538

Low Profile Dual-Band Dual-Polarized Transmitarray Antenna for Satellite Communications

Autores: Raffaele De Marco, Luigi Boccia, Giandomenico Amendola, Emilio Arnieri, Francesco Greco, Arman Bordbar
Publicado en: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Página(s) 4, ISBN 978-1-6654-7541-9
Editor: IEEE
DOI: 10.23919/eucap57121.2023.10133627

Preliminary Results on a Compact Duplexer Design for K/Ka-Band SatCom on the Move User Terminals

Autores: C. Mustacchio, T. Chaloun, M. Fischer, E. Arnieri, G. Amendola and L. Boccia
Publicado en: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Editor: IEEE
DOI: 10.1109/mms55062.2022.9825497

SiGe BiCMOS building blocks for a K/Ka-band flexible phasedarray system for SatCom applications

Autores: A. Colzani, M. Fumagalli and A. Fonte
Publicado en: 2022 Microwave Mediterranean Symposium (MMS), 2022, 2022
Editor: IEEE
DOI: 10.1109/mms55062.2022.9825538

20 GHz LNA and 29 GHz PA on SiGe BiCMOS technology for SatCom phased array systems

Autores: M. Fumagalli, A. Colzani, A. Fonte
Publicado en: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Página(s) 4
Editor: IEEE
DOI: 10.23919/eumic54520.2022.9923435

Wide-Angle Scanning Coupled Dipole Antenna Array for Heterogeneous mm-Wave Comunication Networks

Autores: M.Fischer, C. Waldschmidt, T. Chaloun
Publicado en: 17th European Conference on Antennas and Propagation (EuCAP), 2023, Página(s) 4, ISBN 978-1-6654-7541-9
Editor: IEEE
DOI: 10.23919/eucap57121.2023.10133501

20 GHz LNA and 29 GHz PA on SiGe BiCMOS technology for SatCom phased array systems

Autores: Matteo Fumagalli, Alberto Colzani, Alessandro Fonte
Publicado en: 2022 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Página(s) 130-133
Editor: IEEE
DOI: 10.23919/eumic54520.2022.9923435

An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package

Autores: Z. Cao, B. Heusdens, A. Ziaei and M. Kaynak
Publicado en: 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, Página(s) 4
Editor: IEEE
DOI: 10.23919/eumic54520.2022.9923481

The Wafer-Level Package Integration of a K/ Ka Band Diplexer-on-PCB

Autores: Z. Cao, M. Stocchi, M. Wietstruck and M. Kaynak
Publicado en: IEEE MTT-S International Microwave Filter Workshop (IMFW), 2021
Editor: IEEE

An advanced finite element model of the Cu pillar solder reflow assembly

Autores: Z. Cao, B. Pekkolay, A. Okur, B. Heusdens, C. Carta, M. Kaynak
Publicado en: 24th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, ISBN 979-8-3503-4597-1
Editor: IEEE
DOI: 10.1109/eurosime56861.2023.10100808

Preliminary Results on a Compact Duplexer Design for K/Ka-Band SatCom on the Move User Terminals

Autores: Carmine Mustacchio, Tobias Chaloun, Michael Fischer, Emilio Arnieri, Giandomenico Amendola, Luigi Boccia
Publicado en: 2022 Microwave Mediterranean Symposium (MMS), 2022, Página(s) 1-3
Editor: IEEE
DOI: 10.1109/mms55062.2022.9825497

Other (1)

The Wafer-Level Package Integration of a K/ Ka Band Diplexer-on-PCB

Autores: Z. Cao, M. Stocchi, M. Wietstruck and M. Kaynak
Publicado en: IEEE MTT-S International Microwave Filter Workshop (IMFW), Edición 2, 2021
Editor: IEEE