MULTISPECTRAL INTELLIGENT VISION SYSTEM WITH EMBEDDED LOW-POWER NEURAL COMPUTING

Información del proyecto

MISEL

Identificador del acuerdo de subvención: 101016734

DOI 10.3030/101016734

Fecha de la firma de la CE 1 Diciembre 2020

Fecha de inicio 1 Enero 2021

Fecha de finalización 30 Junio 2025

Financiado con arreglo a

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Coste total € 4 969 451,25

Aportación de la UE € 4 969 451,25

Coordinado por

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Finland

Resultado final

Documents, reports (4)

Evaluation report for the perception layer

The SoA algorithms identified for evaluation of the sensor layer will be evaluated in parallel with the standard video and the sensor layer's images of the evaluation corpus and the relative performance measured formally.

Report describing the task and algorithm chosen in Task 4.2

This report will describe the task chosen for the evaluation of the sensor layer including type of data needed annotations metrics SoA algorithms and identified available implementations

Report on the ferroelectric device performance and CMOS integration

This report will describe the electrical and structural properties of ferroelectric devices and their integration strategies with Si CMOS technology platform

Report describing the task, algorithm and metrics chosen in Task 4.4

This report will describe the task chosen for the evaluation of the computational layer including preexisting datasets with annotations metrics SoA algorithms and identified available implementations

Other (2)

Cortex processor computational architecture for the WAFER2 run

Specification of functionalities proposed for the target version of the cortex processor and computational architectures that provide their implementation. Specification of interfaces to other modules and protocols proposed for data exchange.

Evaluation corpus

This corpus will be created and annotated to evaluate the sensor layer, with parallel sensor layer and standard video imaging.

Publicaciones

Thesis and dissertations (1)

Performance of Ferroelectric Tunnel Junctions on Crossbar Array Circuits

Autores: Oscar Kaatranen
Publicado en: 2022
Editor: Aaalto University, School of Science
DOI: 10.5281/zenodo.7028135

Peer reviewed articles (4)

2D materials for future heterogeneous electronics

Autores: Max C. Lemme, Deji Akinwande, Cedric Huyghebaert, Christoph Stampfer
Publicado en: Nature Communications, 2022, ISSN 2041-1723
Editor: Nature Publishing Group
DOI: 10.1038/s41467-022-29001-4

Back-End CMOS Compatible and Flexible Ferroelectric Memories for Neuromorphic Computing and Adaptive Sensing

Autores: Majumdar, Sayani
Publicado en: Advanced Intelligent Systems, Edición 4, 2021, ISSN 2640-4567
Editor: Wiley-VCH GmbH
DOI: 10.1002/aisy.202100175

Ultrafast switching and linear conductance modulation in ferroelectric tunnel junctions via P(VDF-TrFE) morphology control

Autores: Sayani Majumdar
Publicado en: Nanoscale, Edición 13/25, 2021, Página(s) 11270-11278, ISSN 2040-3364
Editor: Royal Society of Chemistry
DOI: 10.1039/d1nr01722e

Ferroelectric-Antiferroelectric Transition of Hf1-XZrXO2 on Indium Arsenide with Enhanced Ferroelectric Characteristics for Hf0.2Zr0.8O2

Autores: H. Dahlberg, A. Persson, R. Athle, L-E. Wernersson,
Publicado en: ACS APPLIED ELECTRONIC MATERIALS, Edición 4, 2022, Página(s) 6357-6363, ISSN 2637-6113
Editor: ACS
DOI: 10.1021/acsaelm.2c01483

Conference proceedings (6)

A General-Purpose CMOS Vision Sensor with In-Pixel 5-bit Convolutional Layer Computation

Autores: D. Garcia Lesta; O. Pereira Rial; V.M. Brea; P. Lopez; D. Cabello
Publicado en: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022, Página(s) 1-4, ISBN 978-1-6654-8823-5
Editor: IEEE
DOI: 10.1109/icecs202256217.2022.9971111

Dynamics of Polarization Switching in Mixed Phase Ferroelectric-Antiferroelectric HZO Thin Films

Autores: H Dahlberg and L-E Wernersson
Publicado en: ESSDERC 2023, 2023
Editor: IEEE
DOI: 10.1109/essderc59256.2023.10268561

HDC8192: A General Purpose Mixed-Signal CMOS Architecture for Massively Parallel Hyperdimensional Computing

Autores: D. García-Lesta; F. Pardo; O. Pereira-Rial; V.M. Brea; P. López
Publicado en: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Editor: IEEE
DOI: 10.5281/zenodo.6980086

Combining Deep Convolutional Feature Extraction with Hyperdimensional Computing for Visual Object Recognition

Autores: Łuczak, Piotr; Ślot, Krzysztof; Kucharski, Jacek
Publicado en: 2022 International Joint Conference on Neural Networks (IJCNN), 2022
Editor: IEEE
DOI: 10.5281/zenodo.7010008

MoS₂/Quantum Dot Hybrid Photodetectors on Flexible Substrates

Autores: Ozan Yakar; Burkay Uzlu; Daniel S. Schneider; Annika Grundmann; Soren Becker; Jan S. Niehaus; Hendrik Schlicke; Michael Heuken; Holger Kalisch; Andrei Vescan; Zhenxing Wang; Max C. Lemme
Publicado en: Proceedings of the 2022 Device Research Conference (DRC), 2022, Página(s) 1-2, ISBN 978-1-6654-9883-8
Editor: IEEE
DOI: 10.1109/drc55272.2022.9855791

Design of a 5-bit Signed SRAM-based In-Memory Computing Cell for Deep Learning Models

Autores: O. Pereira-Rial, D. García-Lesta, V.M. Brea, P. López, D. Cabello
Publicado en: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Editor: IEEE
DOI: 10.5281/zenodo.6821987