CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
The SoA algorithms identified for evaluation of the sensor layer will be evaluated in parallel with the standard video and the sensor layer's images of the evaluation corpus and the relative performance measured formally.
Report describing the task and algorithm chosen in Task 4.2 (opens in new window)This report will describe the task chosen for the evaluation of the sensor layer including type of data needed annotations metrics SoA algorithms and identified available implementations
Report on the ferroelectric device performance and CMOS integration (opens in new window)This report will describe the electrical and structural properties of ferroelectric devices and their integration strategies with Si CMOS technology platform
Report describing the task, algorithm and metrics chosen in Task 4.4 (opens in new window)This report will describe the task chosen for the evaluation of the computational layer including preexisting datasets with annotations metrics SoA algorithms and identified available implementations
Specification of functionalities proposed for the target version of the cortex processor and computational architectures that provide their implementation. Specification of interfaces to other modules and protocols proposed for data exchange.
Evaluation corpus (opens in new window)This corpus will be created and annotated to evaluate the sensor layer, with parallel sensor layer and standard video imaging.
Publications
Author(s):
Oscar Kaatranen
Published in:
2022
Publisher:
Aaalto University, School of Science
DOI:
10.5281/zenodo.7028135
Author(s):
Lehtonen, Eero; Komulainen, Tuomo; Paasio, Ari; Laiho, Mika
Published in:
Issue 3, 2024
Publisher:
arXiv
DOI:
10.48550/arxiv.2409.01764
Author(s):
Max C. Lemme, Deji Akinwande, Cedric Huyghebaert, Christoph Stampfer
Published in:
Nature Communications, 2022, ISSN 2041-1723
Publisher:
Nature Publishing Group
DOI:
10.1038/s41467-022-29001-4
Author(s):
Christoffer Kauppinen
Published in:
Journal of Vacuum Science & Technology A, Issue 42, 2024, ISSN 0734-2101
Publisher:
American Institute of Physics
DOI:
10.1116/6.0003170
Author(s):
Hannes Dahlberg, Oscar Kaatranen, Karl-Magnus Persson, Arto Rantala, Jacek Flak, Lars-Erik Wernersson
Published in:
IEEE Access, Issue 13, 2025, Page(s) 9923-9930, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2025.3527628
Author(s):
Majumdar, Sayani
Published in:
Advanced Intelligent Systems, Issue 4, 2021, ISSN 2640-4567
Publisher:
Wiley-VCH GmbH
DOI:
10.1002/aisy.202100175
Author(s):
Sayani Majumdar
Published in:
Nanoscale, Issue 13/25, 2021, Page(s) 11270-11278, ISSN 2040-3364
Publisher:
Royal Society of Chemistry
DOI:
10.1039/d1nr01722e
Author(s):
Wenwen Fei, Jens Trommer, Max Christian Lemme, Thomas Mikolajick, André Heinzig
Published in:
InfoMat, Issue 4, 2024, ISSN 2567-3165
Publisher:
Wiley
DOI:
10.1002/inf2.12355
Author(s):
Quỳnh Thị Phùng, Lukas Völkel, Agata Piacentini, Ardeshir Esteki, Annika Grundmann, Holger Kalisch, Michael Heuken, Andrei Vescan, Daniel Neumaier, Max C. Lemme, Alwin Daus
Published in:
ACS Applied Materials & Interfaces, Issue 16, 2025, Page(s) 60541-60547, ISSN 1944-8244
Publisher:
American Chemical Society
DOI:
10.1021/acsami.4c13296
Author(s):
Sha Li, Zhenxing Wang, Bianca Robertz, Daniel Neumaier, Oihana Txoperena, Aranzazu Maestre, Amaia Zurutuza, Chris Bower, Ashley Rushton, Yinglin Liu, Chris Harris, Alexander Bessonov, Surama Malik, Mark Allen, Ivonne Medina-Salazar, Tapani Ryhänen, Max C. Lemme
Published in:
Scientific Reports, Issue 15, 2025, ISSN 2045-2322
Publisher:
Nature Publishing Group
DOI:
10.1038/s41598-025-96207-z
Author(s):
Alexander Löwen, Naveen Kolluru, Zhuang Miao, Christian Tückmantel, Cedric Kreusel, Stefan Janicke, Thomas Riedl, Daniel Neumaier
Published in:
ACS Applied Materials & Interfaces, Issue 17, 2025, Page(s) 9646-9654, ISSN 1944-8244
Publisher:
American Chemical Society
DOI:
10.1021/acsami.4c14665
Author(s):
H. Dahlberg, A. Persson, R. Athle, L-E. Wernersson,
Published in:
ACS APPLIED ELECTRONIC MATERIALS, Issue 4, 2022, Page(s) 6357-6363, ISSN 2637-6113
Publisher:
ACS
DOI:
10.1021/acsaelm.2c01483
Author(s):
D. Garcia Lesta; O. Pereira Rial; V.M. Brea; P. Lopez; D. Cabello
Published in:
2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022, Page(s) 1-4, ISBN 978-1-6654-8823-5
Publisher:
IEEE
DOI:
10.1109/icecs202256217.2022.9971111
Author(s):
Mika Grönroos, Ari Paasio, Mika Laiho
Published in:
2025 IEEE International Symposium of Circuits and Systems (ISCAS 2025), 2025
Publisher:
IEEE
DOI:
10.5281/zenodo.16948453
Author(s):
H Dahlberg and L-E Wernersson
Published in:
ESSDERC 2023, 2023
Publisher:
IEEE
DOI:
10.1109/essderc59256.2023.10268561
Author(s):
D. García-Lesta; F. Pardo; O. Pereira-Rial; V.M. Brea; P. López
Published in:
2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Publisher:
IEEE
DOI:
10.5281/zenodo.6980086
Author(s):
Łuczak, Piotr; Ślot, Krzysztof; Kucharski, Jacek
Published in:
2022 International Joint Conference on Neural Networks (IJCNN), 2022
Publisher:
IEEE
DOI:
10.5281/zenodo.7010008
Author(s):
Ó. Pereira-Rial, H. Dahlberg, D. García-Lesta, V.M. Brea, P. López, D. Cabello, L.-E. Wernersson
Published in:
2025 IEEE International Symposium of Circuits and Systems (ISCAS 2025), 2025
Publisher:
IEEE
DOI:
10.5281/zenodo.16970244
Author(s):
Ozan Yakar; Burkay Uzlu; Daniel S. Schneider; Annika Grundmann; Soren Becker; Jan S. Niehaus; Hendrik Schlicke; Michael Heuken; Holger Kalisch; Andrei Vescan; Zhenxing Wang; Max C. Lemme
Published in:
Proceedings of the 2022 Device Research Conference (DRC), 2022, Page(s) 1-2, ISBN 978-1-6654-9883-8
Publisher:
IEEE
DOI:
10.1109/drc55272.2022.9855791
Author(s):
O. Pereira-Rial, D. García-Lesta, V.M. Brea, P. López, D. Cabello
Published in:
2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Publisher:
IEEE
DOI:
10.1109/ISCAS48785.2022.9937766
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