MULTISPECTRAL INTELLIGENT VISION SYSTEM WITH EMBEDDED LOW-POWER NEURAL COMPUTING

Project Information

MISEL

Grant agreement ID: 101016734

DOI 10.3030/101016734

EC signature date 1 December 2020

Start date 1 January 2021

End date 30 June 2025

Funded under

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Total cost € 4 969 451,25

EU contribution € 4 969 451,25

Coordinated by

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Finland

Deliverables

Documents, reports (4)

Evaluation report for the perception layer

The SoA algorithms identified for evaluation of the sensor layer will be evaluated in parallel with the standard video and the sensor layer's images of the evaluation corpus and the relative performance measured formally.

Report describing the task and algorithm chosen in Task 4.2

This report will describe the task chosen for the evaluation of the sensor layer including type of data needed annotations metrics SoA algorithms and identified available implementations

Report on the ferroelectric device performance and CMOS integration

This report will describe the electrical and structural properties of ferroelectric devices and their integration strategies with Si CMOS technology platform

Report describing the task, algorithm and metrics chosen in Task 4.4

This report will describe the task chosen for the evaluation of the computational layer including preexisting datasets with annotations metrics SoA algorithms and identified available implementations

Other (2)

Cortex processor computational architecture for the WAFER2 run

Specification of functionalities proposed for the target version of the cortex processor and computational architectures that provide their implementation. Specification of interfaces to other modules and protocols proposed for data exchange.

Evaluation corpus

This corpus will be created and annotated to evaluate the sensor layer, with parallel sensor layer and standard video imaging.

Publications

Thesis and dissertations (1)

Performance of Ferroelectric Tunnel Junctions on Crossbar Array Circuits

Author(s): Oscar Kaatranen
Published in: 2022
Publisher: Aaalto University, School of Science
DOI: 10.5281/zenodo.7028135

Peer reviewed articles (4)

2D materials for future heterogeneous electronics

Author(s): Max C. Lemme, Deji Akinwande, Cedric Huyghebaert, Christoph Stampfer
Published in: Nature Communications, 2022, ISSN 2041-1723
Publisher: Nature Publishing Group
DOI: 10.1038/s41467-022-29001-4

Back-End CMOS Compatible and Flexible Ferroelectric Memories for Neuromorphic Computing and Adaptive Sensing

Author(s): Majumdar, Sayani
Published in: Advanced Intelligent Systems, Issue 4, 2021, ISSN 2640-4567
Publisher: Wiley-VCH GmbH
DOI: 10.1002/aisy.202100175

Ultrafast switching and linear conductance modulation in ferroelectric tunnel junctions via P(VDF-TrFE) morphology control

Author(s): Sayani Majumdar
Published in: Nanoscale, Issue 13/25, 2021, Page(s) 11270-11278, ISSN 2040-3364
Publisher: Royal Society of Chemistry
DOI: 10.1039/d1nr01722e

Ferroelectric-Antiferroelectric Transition of Hf1-XZrXO2 on Indium Arsenide with Enhanced Ferroelectric Characteristics for Hf0.2Zr0.8O2

Author(s): H. Dahlberg, A. Persson, R. Athle, L-E. Wernersson,
Published in: ACS APPLIED ELECTRONIC MATERIALS, Issue 4, 2022, Page(s) 6357-6363, ISSN 2637-6113
Publisher: ACS
DOI: 10.1021/acsaelm.2c01483

Conference proceedings (6)

A General-Purpose CMOS Vision Sensor with In-Pixel 5-bit Convolutional Layer Computation

Author(s): D. Garcia Lesta; O. Pereira Rial; V.M. Brea; P. Lopez; D. Cabello
Published in: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022, Page(s) 1-4, ISBN 978-1-6654-8823-5
Publisher: IEEE
DOI: 10.1109/icecs202256217.2022.9971111

Dynamics of Polarization Switching in Mixed Phase Ferroelectric-Antiferroelectric HZO Thin Films

Author(s): H Dahlberg and L-E Wernersson
Published in: ESSDERC 2023, 2023
Publisher: IEEE
DOI: 10.1109/essderc59256.2023.10268561

HDC8192: A General Purpose Mixed-Signal CMOS Architecture for Massively Parallel Hyperdimensional Computing

Author(s): D. García-Lesta; F. Pardo; O. Pereira-Rial; V.M. Brea; P. López
Published in: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Publisher: IEEE
DOI: 10.5281/zenodo.6980086

Combining Deep Convolutional Feature Extraction with Hyperdimensional Computing for Visual Object Recognition

Author(s): Łuczak, Piotr; Ślot, Krzysztof; Kucharski, Jacek
Published in: 2022 International Joint Conference on Neural Networks (IJCNN), 2022
Publisher: IEEE
DOI: 10.5281/zenodo.7010008

MoS₂/Quantum Dot Hybrid Photodetectors on Flexible Substrates

Author(s): Ozan Yakar; Burkay Uzlu; Daniel S. Schneider; Annika Grundmann; Soren Becker; Jan S. Niehaus; Hendrik Schlicke; Michael Heuken; Holger Kalisch; Andrei Vescan; Zhenxing Wang; Max C. Lemme
Published in: Proceedings of the 2022 Device Research Conference (DRC), 2022, Page(s) 1-2, ISBN 978-1-6654-9883-8
Publisher: IEEE
DOI: 10.1109/drc55272.2022.9855791

Design of a 5-bit Signed SRAM-based In-Memory Computing Cell for Deep Learning Models

Author(s): O. Pereira-Rial, D. García-Lesta, V.M. Brea, P. López, D. Cabello
Published in: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Publisher: IEEE
DOI: 10.5281/zenodo.6821987