MULTISPECTRAL INTELLIGENT VISION SYSTEM WITH EMBEDDED LOW-POWER NEURAL COMPUTING

Informations projet

MISEL

N° de convention de subvention: 101016734

DOI

10.3030/101016734

Projet clôturé

Date de signature de la CE 1 Decembre 2020

Date de début 1 Janvier 2021

Date de fin 30 Juin 2025

Financé au titre de

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Coût total

€ 4 969 451,25

Contribution de l’UE

€ 4 969 451,25

Coordonné par

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Finland

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Documents, reports (4)

Evaluation report for the perception layer

The SoA algorithms identified for evaluation of the sensor layer will be evaluated in parallel with the standard video and the sensor layer's images of the evaluation corpus and the relative performance measured formally.

Report describing the task and algorithm chosen in Task 4.2

This report will describe the task chosen for the evaluation of the sensor layer including type of data needed annotations metrics SoA algorithms and identified available implementations

Report on the ferroelectric device performance and CMOS integration

This report will describe the electrical and structural properties of ferroelectric devices and their integration strategies with Si CMOS technology platform

Report describing the task, algorithm and metrics chosen in Task 4.4

This report will describe the task chosen for the evaluation of the computational layer including preexisting datasets with annotations metrics SoA algorithms and identified available implementations

Other (2)

Cortex processor computational architecture for the WAFER2 run

Specification of functionalities proposed for the target version of the cortex processor and computational architectures that provide their implementation. Specification of interfaces to other modules and protocols proposed for data exchange.

Evaluation corpus

This corpus will be created and annotated to evaluate the sensor layer, with parallel sensor layer and standard video imaging.

Publications

Thesis and dissertations (1)

Performance of Ferroelectric Tunnel Junctions on Crossbar Array Circuits

Auteurs: Oscar Kaatranen
Publié dans: 2022
Éditeur: Aaalto University, School of Science
DOI: 10.5281/zenodo.7028135

Other (1)

Gradient events: improved acquisition of visual information in event cameras

Auteurs: Lehtonen, Eero; Komulainen, Tuomo; Paasio, Ari; Laiho, Mika
Publié dans: Numéro 3, 2024
Éditeur: arXiv
DOI: 10.48550/arxiv.2409.01764

Peer reviewed articles (10)

2D materials for future heterogeneous electronics

Auteurs: Max C. Lemme, Deji Akinwande, Cedric Huyghebaert, Christoph Stampfer
Publié dans: Nature Communications, 2022, ISSN 2041-1723
Éditeur: Nature Publishing Group
DOI: 10.1038/s41467-022-29001-4

Atomic layer etching of indium tin oxide

Auteurs: Christoffer Kauppinen
Publié dans: Journal of Vacuum Science & Technology A, Numéro 42, 2024, ISSN 0734-2101
Éditeur: American Institute of Physics
DOI: 10.1116/6.0003170

Memory State Dynamics in BEOL FeFETs: Impact of Area Ratio on Analog Write Mechanisms and Charging

Auteurs: Hannes Dahlberg, Oscar Kaatranen, Karl-Magnus Persson, Arto Rantala, Jacek Flak, Lars-Erik Wernersson
Publié dans: IEEE Access, Numéro 13, 2025, Page(s) 9923-9930, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2025.3527628

Back-End CMOS Compatible and Flexible Ferroelectric Memories for Neuromorphic Computing and Adaptive Sensing

Auteurs: Majumdar, Sayani
Publié dans: Advanced Intelligent Systems, Numéro 4, 2021, ISSN 2640-4567
Éditeur: Wiley-VCH GmbH
DOI: 10.1002/aisy.202100175

Ultrafast switching and linear conductance modulation in ferroelectric tunnel junctions via P(VDF-TrFE) morphology control

Auteurs: Sayani Majumdar
Publié dans: Nanoscale, Numéro 13/25, 2021, Page(s) 11270-11278, ISSN 2040-3364
Éditeur: Royal Society of Chemistry
DOI: 10.1039/d1nr01722e

Emerging reconfigurable electronic devices based on two‐dimensional materials: A review

Auteurs: Wenwen Fei, Jens Trommer, Max Christian Lemme, Thomas Mikolajick, André Heinzig
Publié dans: InfoMat, Numéro 4, 2024, ISSN 2567-3165
Éditeur: Wiley
DOI: 10.1002/inf2.12355

Flexible p-Type WSe₂ Transistors with Alumina Top-Gate Dielectric

Auteurs: Quỳnh Thị Phùng, Lukas Völkel, Agata Piacentini, Ardeshir Esteki, Annika Grundmann, Holger Kalisch, Michael Heuken, Andrei Vescan, Daniel Neumaier, Max C. Lemme, Alwin Daus
Publié dans: ACS Applied Materials & Interfaces, Numéro 16, 2025, Page(s) 60541-60547, ISSN 1944-8244
Éditeur: American Chemical Society
DOI: 10.1021/acsami.4c13296

Graphene-PbS quantum dot hybrid photodetectors from 200 mm wafer scale processing

Auteurs: Sha Li, Zhenxing Wang, Bianca Robertz, Daniel Neumaier, Oihana Txoperena, Aranzazu Maestre, Amaia Zurutuza, Chris Bower, Ashley Rushton, Yinglin Liu, Chris Harris, Alexander Bessonov, Surama Malik, Mark Allen, Ivonne Medina-Salazar, Tapani Ryhänen, Max C. Lemme
Publié dans: Scientific Reports, Numéro 15, 2025, ISSN 2045-2322
Éditeur: Nature Publishing Group
DOI: 10.1038/s41598-025-96207-z

Unconventional Photovoltaic Effect in a Perovskite-Coated Metal–Insulator–Graphene Photodiode

Auteurs: Alexander Löwen, Naveen Kolluru, Zhuang Miao, Christian Tückmantel, Cedric Kreusel, Stefan Janicke, Thomas Riedl, Daniel Neumaier
Publié dans: ACS Applied Materials & Interfaces, Numéro 17, 2025, Page(s) 9646-9654, ISSN 1944-8244
Éditeur: American Chemical Society
DOI: 10.1021/acsami.4c14665

Ferroelectric-Antiferroelectric Transition of Hf1-XZrXO2 on Indium Arsenide with Enhanced Ferroelectric Characteristics for Hf0.2Zr0.8O2

Auteurs: H. Dahlberg, A. Persson, R. Athle, L-E. Wernersson,
Publié dans: ACS APPLIED ELECTRONIC MATERIALS, Numéro 4, 2022, Page(s) 6357-6363, ISSN 2637-6113
Éditeur: ACS
DOI: 10.1021/acsaelm.2c01483

Conference proceedings (8)

A General-Purpose CMOS Vision Sensor with In-Pixel 5-bit Convolutional Layer Computation

Auteurs: D. Garcia Lesta; O. Pereira Rial; V.M. Brea; P. Lopez; D. Cabello
Publié dans: 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022, Page(s) 1-4, ISBN 978-1-6654-8823-5
Éditeur: IEEE
DOI: 10.1109/icecs202256217.2022.9971111

128 × 128 Pixel CMOS Event Camera With Multi-Bit Temporal Difference Event Generation

Auteurs: Mika Grönroos, Ari Paasio, Mika Laiho
Publié dans: 2025 IEEE International Symposium of Circuits and Systems (ISCAS 2025), 2025
Éditeur: IEEE
DOI: 10.5281/zenodo.16948453

Dynamics of Polarization Switching in Mixed Phase Ferroelectric-Antiferroelectric HZO Thin Films

Auteurs: H Dahlberg and L-E Wernersson
Publié dans: ESSDERC 2023, 2023
Éditeur: IEEE
DOI: 10.1109/essderc59256.2023.10268561

HDC8192: A General Purpose Mixed-Signal CMOS Architecture for Massively Parallel Hyperdimensional Computing

Auteurs: D. García-Lesta; F. Pardo; O. Pereira-Rial; V.M. Brea; P. López
Publié dans: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Éditeur: IEEE
DOI: 10.5281/zenodo.6980086

Combining Deep Convolutional Feature Extraction with Hyperdimensional Computing for Visual Object Recognition

Auteurs: Łuczak, Piotr; Ślot, Krzysztof; Kucharski, Jacek
Publié dans: 2022 International Joint Conference on Neural Networks (IJCNN), 2022
Éditeur: IEEE
DOI: 10.5281/zenodo.7010008

Multi-Level Analog Computing-In-Memory FeFET-based Unit Cell for Deep Learning

Auteurs: Ó. Pereira-Rial, H. Dahlberg, D. García-Lesta, V.M. Brea, P. López, D. Cabello, L.-E. Wernersson
Publié dans: 2025 IEEE International Symposium of Circuits and Systems (ISCAS 2025), 2025
Éditeur: IEEE
DOI: 10.5281/zenodo.16970244

MoS₂/Quantum Dot Hybrid Photodetectors on Flexible Substrates

Auteurs: Ozan Yakar; Burkay Uzlu; Daniel S. Schneider; Annika Grundmann; Soren Becker; Jan S. Niehaus; Hendrik Schlicke; Michael Heuken; Holger Kalisch; Andrei Vescan; Zhenxing Wang; Max C. Lemme
Publié dans: Proceedings of the 2022 Device Research Conference (DRC), 2022, Page(s) 1-2, ISBN 978-1-6654-9883-8
Éditeur: IEEE
DOI: 10.1109/drc55272.2022.9855791

Design of a 5-bit Signed SRAM-based In-Memory Computing Cell for Deep Learning Models

Auteurs: O. Pereira-Rial, D. García-Lesta, V.M. Brea, P. López, D. Cabello
Publié dans: 2022 IEEE International Symposium of Circuits and Systems (ISCAS 2022), 2022
Éditeur: IEEE
DOI: 10.1109/ISCAS48785.2022.9937766