Designing high-reliability interconnection materials for accelerated modern electrification

Project Information

SuperSolders

Grant agreement ID: 101031637

DOI

10.3030/101031637

Project terminated on 16 August 2023

EC signature date 19 April 2021

Start date 17 January 2022

End date 16 January 2024

Funded under

• EXCELLENT SCIENCE - Marie Skłodowska-Curie Actions

Total cost

€ 224 933,76

EU contribution

€ 224 933,76

Coordinated by

IMPERIAL COLLEGE OF SCIENCE TECHNOLOGY AND MEDICINE
United Kingdom

Periodic Reporting for period 1 - SuperSolders (Designing high-reliability interconnection materials for accelerated modern electrification)

Reporting period: 2022-01-17 to 2024-01-16

Summary of the context and overall objectives of the project

This project was terminated at its early stage due to the departure of the Fellow Zhaolong Ma.

This project was initially designed to explore novel solder materials for electronic interconnection applications in consumer electronics, automotive, aerospace, and power electronics industries, to address the problems of current materials, such as low performance and high costs. By the termination date of this project, we have explored the use of high entropy alloys (HEAs) and low melting temperature material (Gallium) as the substrate and interconnection materials respectively, to promote the formation of novel compositional complex intermetallics. We have carefully characterized the composed phases of the intermetallic layer and understood their formation mechanisms.

New solders and understandings generated in this study will greatly contribute to developing next-generation high-reliability/performance electronic devices in consumer electronics, power electronics, and automotive/aerospace sector.

The overall objectives are to design novel low-temperature solders, develop high-reliability solders for harsh environment applications, and explore novel TLPB (transient liquid phase bonding) solders for high-temperature applications. By the termination date of this project, we have explored Ga as a novel TLPB solder and HEAs as the TLPB substrates. This Ga/HEAs TLPB system demonstrated a good potential for industry application.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

By the termination date of this project, the Fellow have performed using Ga as the interconnection material and high entropy alloys (HEAs) as the substrate material to fabricate TLPB (transient liquid phase bonding) joints, as an alternative to the traditional Sn/Cu TLPB system. The microstructure of Ga/HEAs TLPB was compared with Ga/CuNi TLPB and Ga/FeNi TLPB systems, and their phases and structure formation mechanisms were revealed. The investigations are still ongoing and will be disseminated until the result outcome is satisfactory.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

New solders and understandings generated in this study will greatly contribute to developing next-generation high-reliability/performance electronic devices in consumer electronics, power electronics, and automotive/aerospace sector.

TLPB joints made with Ga interconnection material and FeCoNiCu high entropy alloy substrate