Periodic Reporting for period 1 - SuperSolders (Designing high-reliability interconnection materials for accelerated modern electrification)
Période du rapport: 2022-01-17 au 2024-01-16
This project was initially designed to explore novel solder materials for electronic interconnection applications in consumer electronics, automotive, aerospace, and power electronics industries, to address the problems of current materials, such as low performance and high costs. By the termination date of this project, we have explored the use of high entropy alloys (HEAs) and low melting temperature material (Gallium) as the substrate and interconnection materials respectively, to promote the formation of novel compositional complex intermetallics. We have carefully characterized the composed phases of the intermetallic layer and understood their formation mechanisms.
New solders and understandings generated in this study will greatly contribute to developing next-generation high-reliability/performance electronic devices in consumer electronics, power electronics, and automotive/aerospace sector.
The overall objectives are to design novel low-temperature solders, develop high-reliability solders for harsh environment applications, and explore novel TLPB (transient liquid phase bonding) solders for high-temperature applications. By the termination date of this project, we have explored Ga as a novel TLPB solder and HEAs as the TLPB substrates. This Ga/HEAs TLPB system demonstrated a good potential for industry application.