The evaluation kit, consisting mainly of the AGTD chip bonded through wire bonding to a printed circuit board (PCB) was also designed and tested. The kit was designed to be a plug-and-play system compatible with standard electronic equipment to enable testing by any industrial partner. The system contains CMOS-compatible materials and processes, it is scalable, and it is compact – thereby meeting three of the most important parameters for future commercial applicability. Furthermore, the device has the potential to cover the full THz spectrum, thereby enabling full broadband operation.
The outcomes of this project show that the FASTERA technology have considerable potential for further development, and eventual deployment within the communications industry.
The potential societal benefits of introducing THz communications are substantial. Since the COVID 19 pandemic there has been a strong shift towards telework, remote education, and telemedicine. Next generation online social interactions, involving AR/VR and metaverses are also set to undergo a major growth period in the coming years. All of these applications require communications systems that provide/enable high rates of data transfer. THz communications will likely be included in an industry-wide roadmap that outlines which technologies or capabilities will become future industry standards. In 2019, the worldwide THz technology market size was $487 million, and it is expected to reach $2271 by the end of 2026, with a CAGR of 24.3% during the forecasted period. The economic benefits of exploiting novel communication technologies will be substantial across the whole telecom value chain – from OEMs, system integrators and component manufacturers up to advanced materials providers (e.g. graphene manufacturers). While THz systems are being rapidly explored in the security or quality control industries, efficient, cost-effective, miniaturised components remain to be broadly implemented – signifying a substantial gap in the market and commercial opportunity.
