Building Active MicroLED displays By Additive Manufacturing

Información del proyecto

BAMBAM

Identificador del acuerdo de subvención: 101070085

DOI

10.3030/101070085

Proyecto cerrado

Fecha de la firma de la CE 23 Junio 2022

Fecha de inicio 1 Septiembre 2022

Fecha de finalización 31 Agosto 2025

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 4 293 264,17

Aportación de la UE

€ 4 293 263,29

Coordinado por

ALEDIA
France

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (3)

Report on dissemination and communication activities: 1st Version

1st version of the report on dissemination and communication activities

Electronics to operate the µLED arrays in a passive (passive RGB µLEDs) or active mode (active pixels) mode
Report on dissemination and communication activities: 2nd version

FInal version of the report on dissemination and communication activities

Demonstrators, pilots, prototypes (4)

First fully processed demonstrator substrate available for module assembly

First fully processed demonstrator substrate available for module assembly:The first fully processed µ-LED matrix display substrate for the final demonstrator is ready for module assembly

Display prototype of the 2nd demonstrator
Operational Test Vehicle

Operational Test Vehicle:adressable 4x4 pixel matrix with transferred and contacted µ-LED chips ready as test vehicule for full demonstrator develpoment

Final 2nd demonstrator with all picture improvements

Publicaciones

Peer reviewed articles (3)

Building Active Matrix MicroLED Displays by Additive Manufacturing (BAMBAM) – Paving the Way to a Sustainable Fine Pitch Video Wall

Autores: Emmanuel Fuchs, Prasanna Ramaswamy, Holger Baur, Sławomir Drozdek, Dave Keeshan, Patrick Willem, Arthur Moisset, Christophe Linchenau, Aymeric Dufauret, Hugues Lebrun, Davina Moodelly, Elisabeth Jacquin, Thibault Catelain, Frédéric Vachelard, Denis Groeninck, Alin Fecioru, Iwona Grądzka-Kurzaj, Aneta Wiatrowska, Clint Meyer, null Matt Meitl, Kai Waldner, Norbert Fruehauf, Mohammad Kiaee, Igor Nakonechnyi, Willem Walrevens, Madeleine Vandenabeele, Matthias Cosaert
Publicado en: Proceedings of the International Display Workshops, 2025, ISSN 1883-2490
Editor: International Display Workshops General Incorporated Association
DOI: 10.36463/IDW.2023.0327

InP-based Quantum Dot Solutions for Efficient and Reliable Color Conversion in MicroLED Applications

Autores: Himanshu Jena, Mohammad Kiaee, Igor Nakonechnyi, Willem Walravens
Publicado en: Proceedings of the International Display Workshops, 2025, ISSN 1883-2490
Editor: International Display Workshops General Incorporated Association
DOI: 10.36463/IDW.2023.0918

Printed Chip Interconnects for MicroLED Displays

Autores: Kai Waldner; Holger Baur; Patrick Schalberger; Norbert Fruehauf; Emmanuel Fuchs; Prasanna Ramaswamy; Vincent Toomey; Sławomir Drozdek
Publicado en: Journal of the Society for Information Display, 2025, ISSN 1938-3657
Editor: Wiley: The Society for Information Display
DOI: 10.1002/JSID.2109

Conference proceedings (4)

Eliminating TFT backplanes in microLED displays using ultra precise deposition (UPD) printed interconnects

Autores: Waldner K et al.
Editor: Electronic Display Conference
DOI: 10.5281/ZENODO.17659252

Building Active Matrix By Additive Manufacturing (BAMBAM)

Autores: Lebrun et al.
Editor: EuroDisplay 2022
DOI: 10.5281/ZENODO.17659269

Printed Chip Interconnects for MicroLED Displays

Autores: Waldner et al.
Editor: EuroDsiplay 2024
DOI: 10.5281/ZENODO.17659226

Process Considerations for Ultraprecise Deposition Printing on Flexible Substrates

Autores: Martin Roemhild, Kai Waldner, Holger Baur, Norbert Fruehauf
Publicado en: 2024 IEEE International Flexible Electronics Technology Conference (IFETC), 2025
Editor: IEEE
DOI: 10.1109/IFETC61155.2024.10771840