Project description
Ultra HDI printed circuit board for new satellites
Driven by the miniaturisation of semiconductor packaging, printed circuit boards (PCBs) quickly followed suit, leading to the development of high-density interconnect (HDI) designs. HDI PCB technology and advanced assemblies are crucial for space projects to benefit from the ever-increasing complexity and functionality of modern integrated circuits such as digital signal processors, field programmable gate arrays and other complex devices. This trend is highlighted by the emergence of the system-in-package (SiP) method for space applications. Considering the pivotal role of HDI PCB designs in the satellite sector, the EU-funded FOCUSING project aims to develop cutting-edge electronic devices employing HDI technology across the full European supply chain, from material manufacturing to PCB delivery. The aim is to significantly improve the performance of space equipment.
Objective
FOCUSING is a powerful playground in which outstanding, worldwide recognized European companies with complementary expertise and state-of-the-art facilities will share and merge their experience with the ultimate goal of exploring and exploiting novel green-oriented routes towards the significant upgrading of the current printed circuit board (PCB) and surface mount technology (SMT) and the enhancement of the overall European competitiveness. Even though space market is addressed in priority, other applications may be addressed.
The growing trend towards miniaturization and the demand of ever more compact and integrated devices have led to an ever increasing interest in printed circuit board with embedded components and in HDI boards, both for the multiple potentialities of a technical-productive nature, and for the encouraging growth prospects of the market demand.
Despite improved manufacturing HDI technologies have been widely demonstrated, and exploited e.g. for automotive, biomedical, and commercial applications, incorporating these improvements in capability with space reliability requirements still representing a challenge.
In this project, HDI technology is considered pivotal for the integration of cutting-edge electronic solutions able to revolutionize the design of present and future products (e.g. from standard sized to micro and nano satellites) by reducing the payload and boosting the performances of the space equipment.
The objective of the proposed activity is double :
• To develop and validate state-of-the-art building blocks to demonstrate the reliability of the technologies and processes developed
• To build a fully European competitive, sustainable and independent supply chain based on state-of-the-art laminates and cutting-edge HDI PCB manufacturing technology focused on advanced Space applications but potentially benefiting as well to other applications.
Fields of science
Programme(s)
Topic(s)
Funding Scheme
RIA - Research and Innovation actionCoordinator
00159 ROMA
Italy
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.