The 2DMEM project has advanced the state of the art in 2D-material-based memristors by moving from simplified descriptions of resistive switching to a predictive, physics-based understanding grounded in atomistic modeling.
Key results:
• Developed experimentally validated atomic-scale models of TMD memristors, incorporating realistic defect densities and impurities.
• Quantified dominant diffusion mechanisms, including sulfur vacancies and metal ions, under applied fields, determining migration energy barriers accurately.
• Demonstrated that resistive switching arises from combined effects of defect dynamics, electric fields, and local structural factors.
• Identified local strain as a key factor influencing defect mobility, conductive filament formation, and switching stability.
• Integrated first-principles simulations with quantum transport modelling, linking atomic-scale processes directly to device-level electrical behavior.
Advancement beyond the state of the art: The project establishes a comprehensive framework capturing interactions between defects, ion migration, electric fields, and strain, addressing limitations of existing models. It provides measurable parameters for device design and simulation, bridging fundamental materials physics and practical device operation.
Potential impacts: Scientifically, the results offer a reliable framework for studying resistive switching in 2DM systems. Technologically, they enable more energy-efficient and reliable memristors, supporting neuromorphic computing and next-generation memory. Industrially, findings are directly relevant to semiconductor R&D and advanced memory integration. At the European level, the project strengthens capabilities in nanoelectronics, materials, and semiconductor innovation. Impacts are medium-term at the device level, guiding design and optimization, and long-term at the system level, supporting energy-efficient computing and AI hardware.
Key needs for uptake and success: Further research should extend the framework to more materials and device architectures and validate predictions experimentally. Demonstrating mechanisms in prototypes will confirm performance improvements. Integrating models into industrial simulation tools and engaging with industry partners will support commercialization. Continued international collaboration and alignment with European semiconductor initiatives will enhance funding, infrastructure access, and innovation pathways.