Building a European industrial supply chain for SOI- and SiN-based silicon photonics, including heterogeneous integration to support emerging markets

Informations projet

photonixFAB

N° de convention de subvention: 101111896

DOI

10.3030/101111896

Date de signature de la CE 12 Mai 2023

Date de début 1 Mai 2023

Date de fin 31 Octobre 2026

Financé au titre de

• Digital, Industry and Space

Coût total

€ 41 945 615,36

Contribution de l’UE

€ 13 192 725,45

Coordonné par

X-FAB FRANCE
France

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Data Management Plan (1)

Data Management Plan

The DMP provides an analysis of the main elements of the data management policy that will be applied by the project. The DMP contains information such as data set reference and name, data set description, standards and metadata, data sharing and archiving and preservation (including storage and backup) on a dataset by dataset basis.

Documents, reports (2)

ADK release, related to Task 5.4

An assembly design kit for PHIX within the Luceda design software will be released, supporting the SOI and SiN platforms so that the circuit designs from WP9 adhere to the packaging rules.

Plan for dissemination and exploitation incl. communication activities

D10.2 will provide an initial plan for dissemination and exploitation incl. communication and training activities and will be updated at each periodic report based on the project’s progress. It also constitutes an initial dissemination & communication kit for the project, and metrics to track the reach of these activities.

Websites, patent fillings, videos etc. (1)

External IT communication infrastructure and project website

The website will be setup to provide view on the project content and progress and to supply information to external stakeholders

Publications

Conference proceedings (1)

Industrial photonics packaging for high volume applications

Auteurs: Milan Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Martin Kresse, Madeleine Weigel, David De Felipe, Norbert Keil, Joost van Kerkhof
Publié dans: Optical Interconnects XXIV, 2024
Éditeur: SPIE
DOI: 10.1117/12.3000934

Peer reviewed articles (1)

Optical switching for data centers and advanced computing systems [Invited]

Auteurs: Patronas, Giannis; Terzenidis, Nikos; Kashinkunti, Prethvi; Zahavi, Eitan; Syrivelis, Dimitris; Capps, Louis; Wertheimer, Zsolt-Alon; Argyris, Nikos; Fevgas, Athanasios; Thompson, Craig; Ganor, Avraham; Bernauer, Julie; Mentovich, Elad; Bakopoulos, Paraskevas
Publié dans: Journal of Optical Communications and Networking, 2024, ISSN 1943-0639
Éditeur: Optica Publishing Group
DOI: 10.1364/JOCN.534317