Building a European industrial supply chain for SOI- and SiN-based silicon photonics, including heterogeneous integration to support emerging markets

Informazioni relative al progetto

photonixFAB

ID dell’accordo di sovvenzione: 101111896

DOI

10.3030/101111896

Data della firma CE 12 Maggio 2023

Data di avvio 1 Maggio 2023

Data di completamento 31 Ottobre 2026

Finanziato da

• Digital, Industry and Space

Costo totale

€ 41 945 615,36

Contributo UE

€ 13 192 725,45

Coordinato da

X-FAB FRANCE
France

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Data Management Plan (1)

Data Management Plan

The DMP provides an analysis of the main elements of the data management policy that will be applied by the project. The DMP contains information such as data set reference and name, data set description, standards and metadata, data sharing and archiving and preservation (including storage and backup) on a dataset by dataset basis.

Documents, reports (2)

ADK release, related to Task 5.4

An assembly design kit for PHIX within the Luceda design software will be released, supporting the SOI and SiN platforms so that the circuit designs from WP9 adhere to the packaging rules.

Plan for dissemination and exploitation incl. communication activities

D10.2 will provide an initial plan for dissemination and exploitation incl. communication and training activities and will be updated at each periodic report based on the project’s progress. It also constitutes an initial dissemination & communication kit for the project, and metrics to track the reach of these activities.

Websites, patent fillings, videos etc. (1)

External IT communication infrastructure and project website

The website will be setup to provide view on the project content and progress and to supply information to external stakeholders

Pubblicazioni

Conference proceedings (1)

Industrial photonics packaging for high volume applications

Autori: Milan Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Martin Kresse, Madeleine Weigel, David De Felipe, Norbert Keil, Joost van Kerkhof
Pubblicato in: Optical Interconnects XXIV, 2024
Editore: SPIE
DOI: 10.1117/12.3000934

Peer reviewed articles (1)

Optical switching for data centers and advanced computing systems [Invited]

Autori: Patronas, Giannis; Terzenidis, Nikos; Kashinkunti, Prethvi; Zahavi, Eitan; Syrivelis, Dimitris; Capps, Louis; Wertheimer, Zsolt-Alon; Argyris, Nikos; Fevgas, Athanasios; Thompson, Craig; Ganor, Avraham; Bernauer, Julie; Mentovich, Elad; Bakopoulos, Paraskevas
Pubblicato in: Journal of Optical Communications and Networking, 2024, ISSN 1943-0639
Editore: Optica Publishing Group
DOI: 10.1364/JOCN.534317