Building a European industrial supply chain for SOI- and SiN-based silicon photonics, including heterogeneous integration to support emerging markets

Projektinformationen

photonixFAB

ID Finanzhilfevereinbarung: 101111896

DOI

10.3030/101111896

EK-Unterschriftsdatum 12 Mai 2023

Startdatum 1 Mai 2023

Enddatum 31 Oktober 2026

Finanziert unter

• Digital, Industry and Space

Gesamtkosten

€ 41 945 615,36

EU-Beitrag

€ 13 192 725,45

Koordiniert durch

X-FAB FRANCE
France

CORDIS bietet Links zu öffentlichen Ergebnissen und Veröffentlichungen von HORIZONT-Projekten.

Links zu Ergebnissen und Veröffentlichungen von RP7-Projekten sowie Links zu einigen Typen spezifischer Ergebnisse wie Datensätzen und Software werden dynamisch von OpenAIRE abgerufen.

Leistungen

Data Management Plan (1)

Data Management Plan

The DMP provides an analysis of the main elements of the data management policy that will be applied by the project. The DMP contains information such as data set reference and name, data set description, standards and metadata, data sharing and archiving and preservation (including storage and backup) on a dataset by dataset basis.

Documents, reports (2)

ADK release, related to Task 5.4

An assembly design kit for PHIX within the Luceda design software will be released, supporting the SOI and SiN platforms so that the circuit designs from WP9 adhere to the packaging rules.

Plan for dissemination and exploitation incl. communication activities

D10.2 will provide an initial plan for dissemination and exploitation incl. communication and training activities and will be updated at each periodic report based on the project’s progress. It also constitutes an initial dissemination & communication kit for the project, and metrics to track the reach of these activities.

Websites, patent fillings, videos etc. (1)

External IT communication infrastructure and project website

The website will be setup to provide view on the project content and progress and to supply information to external stakeholders

Veröffentlichungen

Conference proceedings (1)

Industrial photonics packaging for high volume applications

Autoren: Milan Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Martin Kresse, Madeleine Weigel, David De Felipe, Norbert Keil, Joost van Kerkhof
Veröffentlicht in: Optical Interconnects XXIV, 2024
Herausgeber: SPIE
DOI: 10.1117/12.3000934

Peer reviewed articles (1)

Optical switching for data centers and advanced computing systems [Invited]

Autoren: Patronas, Giannis; Terzenidis, Nikos; Kashinkunti, Prethvi; Zahavi, Eitan; Syrivelis, Dimitris; Capps, Louis; Wertheimer, Zsolt-Alon; Argyris, Nikos; Fevgas, Athanasios; Thompson, Craig; Ganor, Avraham; Bernauer, Julie; Mentovich, Elad; Bakopoulos, Paraskevas
Veröffentlicht in: Journal of Optical Communications and Networking, 2024, ISSN 1943-0639
Herausgeber: Optica Publishing Group
DOI: 10.1364/JOCN.534317