Project description
Overcoming 2D material industrial uptake challenges
Graphene and 2D materials (2DM) present promising solutions for sensors and imagers, offering significantly enhanced optoelectronic properties and performance. Despite their potential, the adoption and industrial integration of these materials have faced obstacles in achieving wafer-scale integration of high-quality, defect-free 2DM layers during Si foundry process lines. The EU-funded Next-2Digits project aims to address this challenge through the implementation of two innovative additive technologies. These technologies are expected to revolutionise manufacturing, providing defect-free interfaces, improved mobility, and larger bandwidths. Ultimately, the project seeks to facilitate the incorporation of this technology into photonic integrated circuits (PICS) and micro-electro-mechanical systems (MEMS), enhancing ease of industrial adoption and reducing costs.
Objective
Graphene and 2D materials (2DM) have proven superior optoelectronic properties and performance in a plethora of applications with respect to conventional materials. Despite that, specific integration and processing challenges are impeding the industrial uptake of 2DM. In particular, the wafer-scale integration of high-quality and defect free 2DM layers, without disrupting the process-line Si foundries, has not been demonstrated. Next-2Digits will introduce the direct wafer-scale integration of 2DM in PICs using two additive technologies: i) semi dry transfer of Graphene layers for full wafer scale integration and direct die processing and ii) Laser Digital Transfer of pristine 2DM pixels directly on the stack without the need for post-processing. This will enable defect-free interfaces offering high carrier mobility and large bandwidth, paving the way for the next generation of on-chip Photodetectors (PDs) and Modulators which will be validated at TRL5 in three use cases:
1. A miniaturized LiDAR with integrated graphene PD offering high resolution (<0.1mm) and high speed in compact form factor validated in an UAV mapping system.
2. A PIC gas sensor with sensitivity down to 50ppm and miniaturized footprint offering multi-sensing capability validated in a biogas plant leakage sensing system.
3. An on-chip PD receiver offering extended bandwidth (>100nm), high resolution and responsivity >0.5A/W validated in a biomedical OCT imaging system.
The project will foster the incorporation of 2DM in PICs and MEMS foundries, enabling future industrial uptake and significantly shorter time-to-market for 2DM-based devices. Companies will be able to offer PIC-based components with (up to 6x times) lower power consumption, lower size (in orders of magnitude) and more than 50% reduced cost. Widespread adoption of such devices will lead to almost €25M of yearly revenues associated with at least 80 new jobs by 2030 for the partners, as well as environmental and social impacts.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology nanotechnology nano-materials two-dimensional nanostructures graphene
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- natural sciences physical sciences optics laser physics
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.2.4 - Digital, Industry and Space
MAIN PROGRAMME
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HORIZON.2.4.3 - Emerging enabling technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-RIA - HORIZON Research and Innovation Actions
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-CL4-2022-DIGITAL-EMERGING-02
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
157 72 ATHINA
Greece
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.