Descripción del proyecto
Superar los retos de la asimilación industrial de materiales bidimensionales
El grafeno y los materiales bidimensionales presentan soluciones prometedoras para sensores y generadores de imágenes, ya que ofrecen propiedades y prestaciones optoelectrónicas notablemente mejoradas. A pesar de su potencial, la adopción e integración industrial de estos materiales se ha enfrentado a obstáculos al lograr la integración a escala de oblea de capas de materiales bidimensionales de alta calidad y sin defectos durante las líneas de proceso de fundición de Si. El equipo del proyecto Next-2Digits, financiado con fondos europeos, pretende hacer frente a este reto mediante la aplicación de dos tecnologías aditivas innovadoras. Se espera que estas tecnologías revolucionen la fabricación, proporcionando interfaces sin defectos, movilidad mejorada y mayores anchos de banda. En última instancia, el equipo del proyecto pretende facilitar la incorporación de esta tecnología a los circuitos fotónicos integrados y a los sistemas microelectromecánicos, facilitando su adopción industrial y reduciendo costes.
Objetivo
Graphene and 2D materials (2DM) have proven superior optoelectronic properties and performance in a plethora of applications with respect to conventional materials. Despite that, specific integration and processing challenges are impeding the industrial uptake of 2DM. In particular, the wafer-scale integration of high-quality and defect free 2DM layers, without disrupting the process-line Si foundries, has not been demonstrated. Next-2Digits will introduce the direct wafer-scale integration of 2DM in PICs using two additive technologies: i) semi dry transfer of Graphene layers for full wafer scale integration and direct die processing and ii) Laser Digital Transfer of pristine 2DM pixels directly on the stack without the need for post-processing. This will enable defect-free interfaces offering high carrier mobility and large bandwidth, paving the way for the next generation of on-chip Photodetectors (PDs) and Modulators which will be validated at TRL5 in three use cases:
1. A miniaturized LiDAR with integrated graphene PD offering high resolution (<0.1mm) and high speed in compact form factor validated in an UAV mapping system.
2. A PIC gas sensor with sensitivity down to 50ppm and miniaturized footprint offering multi-sensing capability validated in a biogas plant leakage sensing system.
3. An on-chip PD receiver offering extended bandwidth (>100nm), high resolution and responsivity >0.5A/W validated in a biomedical OCT imaging system.
The project will foster the incorporation of 2DM in PICs and MEMS foundries, enabling future industrial uptake and significantly shorter time-to-market for 2DM-based devices. Companies will be able to offer PIC-based components with (up to 6x times) lower power consumption, lower size (in orders of magnitude) and more than 50% reduced cost. Widespread adoption of such devices will lead to almost €25M of yearly revenues associated with at least 80 new jobs by 2030 for the partners, as well as environmental and social impacts.
Ámbito científico
Palabras clave
Programa(s)
Convocatoria de propuestas
HORIZON-CL4-2022-DIGITAL-EMERGING-02
Consulte otros proyectos de esta convocatoriaRégimen de financiación
HORIZON-RIA - HORIZON Research and Innovation ActionsCoordinador
157 80 ATHINA
Grecia