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SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION

Project description

Revolutionising 3D ICs with holographic lithography

As the demand for smaller, more powerful integrated circuits (ICs) grows, manufacturers face increasing complexity and costs with projection lithography (PL), which is limited to producing 2D images on flat surfaces. The extension of PL to 3D imaging is hindered by the trade-off between focus depth and resolution, making the production of wafer-scale 3D components challenging. The EU-funded HoLiSTEP project introduces sub-wavelength holographic lithography (HL), a disruptive technology that overcomes the constraints of PL. By enabling the production of high-resolution 3D topographies, HL offers significant cost reductions and enhanced flexibility in producing novel ICs. The project aims to create an industrial prototype capable of producing high-resolution 3D components for micro-electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS).

Objective

To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required.
HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high-resolution IC much more affordable.
An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20λ and software modules for vector diffraction models.
Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems.
The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.

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HORIZON-IA - HORIZON Innovation Actions

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(opens in new window) HORIZON-CL4-2023-TWIN-TRANSITION-01

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Coordinator

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 1 368 875,00
Address
HANSASTRASSE 27C
80686 MUNCHEN
Germany

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Region
Bayern Oberbayern München, Kreisfreie Stadt
Activity type
Research Organisations
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Participants (6)

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