Recent shortages of semiconductors have highlighted Europe's dependency on a limited number of suppliers outside of the EU. The European Chips Act is a response to critical dependencies and targets the doubling of its global market share, reaching 20% in 2030. In this context it appears crucial to consolidate the European capabilities in the field of semiconductor packaging and more specifically advanced packaging.The Pack4EU CSA aims at building a common roadmap to empower the European semiconductor packaging industry to overcome external competition, encouraging innovation and resilience. The Pack4EU consortium, including associations, clusters, and industrial associated partners, is aiming at a strategy for Europe to implement Advanced packaging Capabilities for the European Markert.
With diverse perspectives, a bottom-up approach maps, prioritizes, and implements short-term ideas for visible results by 2026. Beyond technology, critical factors such as sustainability, recyclability, digitalization, and skills shortage shape the industry's future. The strategy must encompass these constraints.
In order to federate and create momentum, the methodology will adopt 3 steps:
• Mapping the European resources in packaging
• Data Analysis and recommendations.
• Create a pan-european network in advanced packaging
The Pack4EU initiative aims to unite the European Packaging industry and research institutions, crafting a common roadmap to boost competitiveness. By involving supply and demand, research, and education, it aspires to secure Europe's technological edge and maintain sovereignty.
