BOOSTER PACKAGING FOR EUROPE

Projektinformationen

Pack4EU

ID Finanzhilfevereinbarung: 101139933

DOI

10.3030/101139933

Projekt abgeschlossen

EK-Unterschriftsdatum 22 August 2023

Startdatum 1 Juli 2023

Enddatum 30 Juni 2024

Finanziert unter

• Digital, Industry and Space

Gesamtkosten

€ 999 905,00

EU-Beitrag

€ 999 030,00

Koordiniert durch

BLUMORPHO
France

Periodic Reporting for period 1 - Pack4EU (BOOSTER PACKAGING FOR EUROPE)

Berichtszeitraum: 2023-07-01 bis 2024-06-30

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

Recent shortages of semiconductors have highlighted Europe's dependency on a limited number of suppliers outside of the EU. The European Chips Act is a response to critical dependencies and targets the doubling of its global market share, reaching 20% in 2030. In this context it appears crucial to consolidate the European capabilities in the field of semiconductor packaging and more specifically advanced packaging.The Pack4EU CSA aims at building a common roadmap to empower the European semiconductor packaging industry to overcome external competition, encouraging innovation and resilience. The Pack4EU consortium, including associations, clusters, and industrial associated partners, is aiming at a strategy for Europe to implement Advanced packaging Capabilities for the European Markert.

With diverse perspectives, a bottom-up approach maps, prioritizes, and implements short-term ideas for visible results by 2026. Beyond technology, critical factors such as sustainability, recyclability, digitalization, and skills shortage shape the industry's future. The strategy must encompass these constraints.
In order to federate and create momentum, the methodology will adopt 3 steps:
• Mapping the European resources in packaging
• Data Analysis and recommendations.
• Create a pan-european network in advanced packaging

The Pack4EU initiative aims to unite the European Packaging industry and research institutions, crafting a common roadmap to boost competitiveness. By involving supply and demand, research, and education, it aspires to secure Europe's technological edge and maintain sovereignty.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

Pack4EU has conducted more than 50 interviews and delivered 19 workshops at all the levels of the value chain. The 5 key markets for Europe have been considered: Automotive, Telecom,Industry, Health and Sovereign Markets.

A draft of the technical roadmaps has been proposed for Power Electronics, 5G, AI, CHiplet architecture, Quantum computing and Photonics.

A patent analysis has been performed to identify the main players worldwide and to position Europe in this landscape. Multiple actions have been conducted to survey the potential collaborations at the international level.

The topic of sustainability, digitalisation and design have been specifically analysed to understand if these approaches could be a source of differentiation or added value. The needs in workforce has also been analysed from various sources and a benchmark of the education policies in mulitple countries have been conducted (US, China, Japan, Malaysia).

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

The main final results are:
Mapping of the capacities in Europe has been performed with the identification of Hot Spots and Key regions in packaging.
A database of all the players in offer and demand taking also into account the equipment suppliers.
Priorities in international collaboration have been set
Challenges in Sustainability have been identified
The needs in European workforce are estimated to reach 6000 workers wuthin 3 years and could reach 40 000 by 2032