European Commission logo
English English
CORDIS - EU research results
CORDIS

BOOSTER PACKAGING FOR EUROPE

Project description

A green solution for Europe’s semiconductor challenge

Europe’s semiconductor industry faces a critical challenge: a growing dependency on foreign suppliers for advanced semiconductor packaging. With global demand skyrocketing, Europe must act swiftly to secure its position in this pivotal technology sector. The lack of a unified strategy hampers the drive to innovation, as well as the creation of local jobs, and actions to address environmental concerns. With this in mind, the EU-funded Pack4EU project aims to establish a pan-European network on advanced semiconductor packaging and develop the Advanced Semiconductor Packaging Master Plan for Europe. By fostering collaboration, innovation, and sustainability, Pack4EU seeks to fortify Europe’s semiconductor packaging capabilities and secure its future in this dynamic field.

Objective

Pack4EU’s objectives are (1) the creation of the “Pan European network on advanced semiconductor packaging”, and (2) give guidance and deliver the awaited urgent results through policy recommendations, the “Advanced Semiconductor Packaging Master Plan for Europe”, addressing investments, pilot lines, competence centers and further coordination actions dedicated to semiconductor packaging and the EU green deal.
This will be worked on by a consortium gathering all the industry associations including the scientific ones supported by 40 associated partners all along the value chain. This group will first create a European definition of advanced semiconductor packaging illustrated by visuals and glossary.

The tasks are: build the “who’s who” of advanced semiconductor packaging, involve SMEs, Start-ups and Scale-ups, RTOs; map the entire supply chain from design, materials, equipment, fabs, and all the way to test and reliability; engage with MS, Regions and the specific agencies to consolidate the policies; study the other Chips Acts deployed in non-member countries and assess the existing European position in the global packaging world, for the most pertinent European needs and applications; aggregate the recent past similar actions at national or regional clusters level; engage with world leading OSATs and European stakeholders to reconsider manufacturing in Europe; assess the gaps in education and skills required for human resources geared towards advanced packaging and citizen’s awareness.

Objectives for guidance also include the Chips-packaging diplomacy, autonomy but no isolation, partnering with competencies from all over the world, vulnerability and sovereignty issues, for a decade long vision and a resilient European industrial infrastructure, making it possible to create local economic strengths, to create local jobs and to maintain and reinforce local advanced know-how and expertise in the long run while reinforcing European leadership in the race to

Coordinator

BLUMORPHO
Net EU contribution
€ 168 250,00
Address
38 RUE JEAN MERMOZ
75008 Paris
France

See on map

SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Ile-de-France Ile-de-France Paris
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 168 250,00

Participants (6)

Partners (43)