Project description
Novel solutions hold promise for high-value imaging applications
Emerging markets in connectivity, mobility, automotive, health and earth monitoring are dictating the need for advanced imaging solutions offering enhanced functionalities and cost efficiency. Currently, the market for visible imagers is dominated by non-European countries. In particular, long-wave infrared imager cost and performance challenges have hindered microbolometers (µbolometers) from penetrating high-volume markets. The EU-funded ATHENA project will seek to strengthen Europe’s high-tech imaging economy. It will do so by leveraging 3D stacking technologies, improving sensor-processing integration and preparing the path for scaling µbolometer manufacturing from 200 to 300 mm CMOS wafers. Project activities include developing cost-effective long-wave infrared optics and new methods for very long-wave infrared imager production. ATHENA is aligned with the EU’s Chips Act and the ECS SRIA to strengthen Europe’s leadership, industrial competitiveness and sovereignty in imaging technologies.
Objective
New strategic and growing markets related to connectivity, mobility, automotive, health and earth monitoring call for improved imaging solutions in visible, LWIR and VLWIR offering advanced functionalities and cost effectiveness. Visible imagers market is currently largely dominated by non-European countries. LWIR µbolometers imagers, fabricated above-IC, have not yet been democratized for high volume markets due to the difficulty to solve performance versus cost equation. However, Asian providers are making important progress to tackle this challenge.
ATHENA aims at strengthening European economy in high-tech imaging technologies:
- by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities
- by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions
- by using new methods of growing and doping materials for future VLWIR imager manufacturability.
This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring.
ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption.
In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.
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HORIZON-JU-RIA - HORIZON JU Research and Innovation ActionsCoordinator
75015 PARIS 15
France
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Participants (19)
38430 MOIRANS
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
91940 LES ULIS
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
91120 Palaiseau
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38000 Grenoble
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08034 Barcelona
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73447 Oberkochen
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38920 Crolles
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06980 Ankara
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28918 Leganes
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
92400 Courbevoie
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H91 Galway
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08180 MOIA BARCELONA
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
84013 CAVA DE TIRRENI SA
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
08193 Cerdanyola Del Valles
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8010 Graz
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447 37 Vargarda
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
300267 TIMISORA
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151 25 MAROUSSI
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
35690 Acigne
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