Periodic Reporting for period 1 - DIAMONIQ (Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications)
Reporting period: 2024-03-01 to 2025-02-28
Backed by IQ Capital, Earlybird, and the EIC Accelerator, QD aims to become the "ASML of post-processing," offering next-gen metrology tools for 3D chip stacking, AI accelerators, and power electronics. The EIC-funded project will advance SQI to industrial readiness (TRL9) by refining resolution (~100 nm), speed (<1 min), and field of view (>50 μm), validated through pilots with industry leaders. While previous efforts focused on achieving the highest possible resolution (nm scale), QD is now prioritizing defect localization, ensuring faster and more efficient failure analysis for semiconductor manufacturing.
Beyond failure analysis, QD is expanding into hardware security, collaborating with Fraunhofer EMFT, AISEC, and TUM to detect side-channel attacks and Hardware-Trojans. To accelerate commercialization, QD onboarded experts from globally leading semiconductor manufacturing and design companies for rapid scale-up. QD has transformed quantum sensing from TRL4 to TRL6 in just 24 months and is now a global leader in next-gen semiconductor metrology, backed by a world-class team and advisors Infineon, TSMC, ARM, and Applied Materials.
QD’s SQI is the only market-ready solution offering ~100 nm defect localization, sub-1 min measurements, and >50 μm 3D imaging in a non-destructive manner. It uniquely enables depth-resolved current mapping and magnetic field imaging, critical for next-gen process control and failure analysis. As highlighted in the 2023 IRDS Metrology Roadmap, 3D measurement is key to future semiconductor manufacturing. By pioneering quantum sensing commercialization, QD strengthens Europe’s metrology leadership and technological sovereignty, while its data-driven analytics and digital twin integration set a new benchmark for process optimization and security verification.