Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications

Projektinformationen

DIAMONIQ

ID Finanzhilfevereinbarung: 101144497

DOI

10.3030/101144497

EK-Unterschriftsdatum 19 Februar 2024

Startdatum 1 März 2024

Enddatum 28 Februar 2027

Finanziert unter

• The European Innovation Council (EIC)

Gesamtkosten

€ 3 536 042,50

EU-Beitrag

€ 2 475 229,75

Koordiniert durch

QUANTUMDIAMONDS GMBH
Germany

Periodic Reporting for period 1 - DIAMONIQ (Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications)

Berichtszeitraum: 2024-03-01 bis 2025-02-28

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

QuantumDiamonds (QD) is a Munich-based deep-tech startup revolutionizing semiconductor testing with quantum sensing. Using nitrogen-vacancy (NV) centers in diamond, QD’s Super-Resolution-Quantum-Imager (SQI) enables non-destructive, high-resolution defect detection, operating at room temperature with sub-100 nm resolution and rapid measurement times. Unlike traditional methods, it improves efficiency and reduces semiconductor scrap rates. Partnering with leading semiconductor companies, QD is integrating its technology into real-world manufacturing to accelerate chip development.
Backed by IQ Capital, Earlybird, and the EIC Accelerator, QD aims to become the "ASML of post-processing," offering next-gen metrology tools for 3D chip stacking, AI accelerators, and power electronics. The EIC-funded project will advance SQI to industrial readiness (TRL9) by refining resolution (~100 nm), speed (<1 min), and field of view (>50 μm), validated through pilots with industry leaders. While previous efforts focused on achieving the highest possible resolution (nm scale), QD is now prioritizing defect localization, ensuring faster and more efficient failure analysis for semiconductor manufacturing.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

QD has developed and commercialized a first-of-its-kind quantum SQI, now deployed at Fraunhofer EMFT for commercial projects with leading microelectronics companies. In 2024, QD provided testing services for seven partners, analyzing GaN power devices and advanced packaging technologies. These tests validated QD’s SQI for semiconductor quality control, with results set for publication in EDFAS (Feb 2025). QD’s Munich lab, established in just four months, showcases its rapid execution and expertise.
Beyond failure analysis, QD is expanding into hardware security, collaborating with Fraunhofer EMFT, AISEC, and TUM to detect side-channel attacks and Hardware-Trojans. To accelerate commercialization, QD onboarded experts from globally leading semiconductor manufacturing and design companies for rapid scale-up. QD has transformed quantum sensing from TRL4 to TRL6 in just 24 months and is now a global leader in next-gen semiconductor metrology, backed by a world-class team and advisors Infineon, TSMC, ARM, and Applied Materials.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

QD is the first commercial quantum sensing company to publish in the Electronic Device Failure Analysis Society (EDFAS), with its February 2025 paper presenting groundbreaking research in quantum-enhanced failure analysis. Further, QD has installed a fully functional demo tool at Fraunhofer EMFT, where it is actively conducting commercial semiconductor testing for selected semiconductor manufacturers. This SQI enables high-resolution, non-destructive defect detection, marking a major step in industrial adoption of quantum sensing for advanced semiconductor metrology. Based on this success, QD now has close collaborations with 14 of the 15 largest semiconductor companies worldwide.
QD’s SQI is the only market-ready solution offering ~100 nm defect localization, sub-1 min measurements, and >50 μm 3D imaging in a non-destructive manner. It uniquely enables depth-resolved current mapping and magnetic field imaging, critical for next-gen process control and failure analysis. As highlighted in the 2023 IRDS Metrology Roadmap, 3D measurement is key to future semiconductor manufacturing. By pioneering quantum sensing commercialization, QD strengthens Europe’s metrology leadership and technological sovereignty, while its data-driven analytics and digital twin integration set a new benchmark for process optimization and security verification.

Extract from published paper

Extract from published paper