Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications

Información del proyecto

DIAMONIQ

Identificador del acuerdo de subvención: 101144497

DOI

10.3030/101144497

Fecha de la firma de la CE 19 Febrero 2024

Fecha de inicio 1 Marzo 2024

Fecha de finalización 28 Febrero 2027

Financiado con arreglo a

• The European Innovation Council (EIC)

Coste total

€ 3 536 042,50

Aportación de la UE

€ 2 475 229,75

Coordinado por

QUANTUMDIAMONDS GMBH
Germany

Periodic Reporting for period 1 - DIAMONIQ (Developing First-in-Class Diamond-based Quantum Microscopy for immediate semiconductor industry applications)

Período documentado: 2024-03-01 hasta 2025-02-28

Resumen del contexto y de los objetivos generales del proyecto

QuantumDiamonds (QD) is a Munich-based deep-tech startup revolutionizing semiconductor testing with quantum sensing. Using nitrogen-vacancy (NV) centers in diamond, QD’s Super-Resolution-Quantum-Imager (SQI) enables non-destructive, high-resolution defect detection, operating at room temperature with sub-100 nm resolution and rapid measurement times. Unlike traditional methods, it improves efficiency and reduces semiconductor scrap rates. Partnering with leading semiconductor companies, QD is integrating its technology into real-world manufacturing to accelerate chip development.
Backed by IQ Capital, Earlybird, and the EIC Accelerator, QD aims to become the "ASML of post-processing," offering next-gen metrology tools for 3D chip stacking, AI accelerators, and power electronics. The EIC-funded project will advance SQI to industrial readiness (TRL9) by refining resolution (~100 nm), speed (<1 min), and field of view (>50 μm), validated through pilots with industry leaders. While previous efforts focused on achieving the highest possible resolution (nm scale), QD is now prioritizing defect localization, ensuring faster and more efficient failure analysis for semiconductor manufacturing.

Trabajo realizado desde el comienzo del proyecto hasta el final del período abarcado por el informe y los principales resultados hasta la fecha

QD has developed and commercialized a first-of-its-kind quantum SQI, now deployed at Fraunhofer EMFT for commercial projects with leading microelectronics companies. In 2024, QD provided testing services for seven partners, analyzing GaN power devices and advanced packaging technologies. These tests validated QD’s SQI for semiconductor quality control, with results set for publication in EDFAS (Feb 2025). QD’s Munich lab, established in just four months, showcases its rapid execution and expertise.
Beyond failure analysis, QD is expanding into hardware security, collaborating with Fraunhofer EMFT, AISEC, and TUM to detect side-channel attacks and Hardware-Trojans. To accelerate commercialization, QD onboarded experts from globally leading semiconductor manufacturing and design companies for rapid scale-up. QD has transformed quantum sensing from TRL4 to TRL6 in just 24 months and is now a global leader in next-gen semiconductor metrology, backed by a world-class team and advisors Infineon, TSMC, ARM, and Applied Materials.

Avances que van más allá del estado de la técnica e impacto potencial esperado (incluida la repercusión socioeconómica y las implicaciones sociales más amplias del proyecto hasta la fecha)

QD is the first commercial quantum sensing company to publish in the Electronic Device Failure Analysis Society (EDFAS), with its February 2025 paper presenting groundbreaking research in quantum-enhanced failure analysis. Further, QD has installed a fully functional demo tool at Fraunhofer EMFT, where it is actively conducting commercial semiconductor testing for selected semiconductor manufacturers. This SQI enables high-resolution, non-destructive defect detection, marking a major step in industrial adoption of quantum sensing for advanced semiconductor metrology. Based on this success, QD now has close collaborations with 14 of the 15 largest semiconductor companies worldwide.
QD’s SQI is the only market-ready solution offering ~100 nm defect localization, sub-1 min measurements, and >50 μm 3D imaging in a non-destructive manner. It uniquely enables depth-resolved current mapping and magnetic field imaging, critical for next-gen process control and failure analysis. As highlighted in the 2023 IRDS Metrology Roadmap, 3D measurement is key to future semiconductor manufacturing. By pioneering quantum sensing commercialization, QD strengthens Europe’s metrology leadership and technological sovereignty, while its data-driven analytics and digital twin integration set a new benchmark for process optimization and security verification.

Extract from published paper

Extract from published paper