Impact of Carrier Foil Configurations on the Reliability of TWILL Interconnection Technology
(öffnet in neuem Fenster)
Autoren:
Hamed Javanbakht Lomeri, Jonathan Govaerts, Bart Reekmans, Dominique Jousset, Tom Borgers, Bin Luo, Yi Zheng, Engin Özkol, Olindo Isabella, Hariharsudan Sivaramakrishnan Radhakrishnan
Veröffentlicht in:
Silicon PV 2025 Conference, 2025
Herausgeber:
Zenodo
DOI:
10.5281/ZENODO.15697824
REDUCTION OF SILVER & INDIUM CONSUMPTION BY COPPER PLATING WITH A DIELECTRIC MASKING LAYER FOR SUSTAINABLE PRODUCTION OF HETEROJUNCTION CELLS
Autoren:
Bertrand Paviet-Salomon, Agata Lachowicz, Jun Zhao, Lison Marthey, Alexis Barrou, Laurie-Lou Senaud, Adeline Lanterne, Johann Jourdan, Jörg Schube, Roman Keding, Sven Kluska and Christophe Ballif
Veröffentlicht in:
13th International Metallization & Interconnection Workshop, 2025
Herausgeber:
International Metallization & Interconnection Workshop
Sustainable, High-throughput, Industry-ready, Next-generation Technology for European Manufacturing Leadership in Photovoltaics (SHINE PV)
(öffnet in neuem Fenster)
Autoren:
Marco Galiazzo, Sven Kluska, Vincent Barth, Jonathan Govaerts, Frank Lenzmann, Giovanni Paolo Borzi, Betina Debastiani Benato, Matevž Bokalič, Margit Lang, and Victor Acinas
Veröffentlicht in:
EU PVSEC 2025, ISBN 3-936338-93-0
Herausgeber:
EU PVSEC
DOI:
10.4229/EUPVSEC2025/1BV.5.24