Project description
APECS leads the way in European chiplet innovation
The global chip shortage has exposed Europe’s vulnerability in microelectronics, threatening industries reliant on advanced semiconductors. Strengthening Europe’s technological resilience requires cutting-edge innovation and sustainable, scalable solutions to meet global demand. Addressing this challenge, the EU-funded APECS-PL project, part of the EU Chips Act, pioneers advanced packaging and heterogeneous integration for electronic components and systems. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), it integrates novel testing, reliability methodologies and a system technology co-optimisation (STCO) framework. Positioned as a key player in Europe’s semiconductor ecosystem, APECS-PL supports a pan-European pilot line vision, enabling industry transfer and fostering eco-design aligned with the EU Green Deal. The project also emphasises skills development for future growth.
Objective
As a contribution to the EU Chips Act, the Research Fab Microelectronics Germany (FMD) proposes an Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line (APECS-PL), which combines the generation of globally competitive high technology that addresses the specific needs of German and European industry and enables a low-threshold, easily scalable industrial transfer. The APECS-PL will include novel characterization, quality assurance, testing & reliability methodologies, test methods to assess the security of microelectronic systems against physical attacks and a System Technology Co Optimization (STCO) framework. Together with the 2 nm GAA (imec), 5 nm FDSOI (Leti) and wide bandgap semiconductor pilot lines also planned within the EU Chips Act, the APECS-PL is also in a position to become an essential component on the way to the vision of a pan-European pilot line facility - and thus an indispensable pillar for achieving the EU Chips Act target of bringing 20% of the global supply of chip production back to Europe. In addition, APECS-PL offers a one-stop shop for a very broad international customer base in basically all classic vertical industrial sectors including large companies, SMEs and technology start-ups. Demonstrators are planned to evaluate how the elements of the pilot line work together. The FMD-OFC office, managed by Fraunhofer as legal entity, is responsible for operational management. As a first step for additional European R&D partners the project partners imec, Leti, VTT, IMB-CNM (CSIC), INL, Forth and TU Graz will be included. The shortage of skilled workers and scientists is of particular interest in the project. Better integration of a gender dimension into research and innovation content will be an essential part of the project. Systematic eco-design that generally minimizes energy and resource consumption is in line with the EU Green Deal.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural sciencesphysical scienceselectromagnetism and electronicsmicroelectronics
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Keywords
Programme(s)
- HORIZON.2.4 - Digital, Industry and Space Main Programme
Topic(s)
Call for proposal
(opens in new window) HORIZON-JU-Chips-2023-RIA-CPL
See other projects for this callFunding Scheme
HORIZON-JU-RIA - HORIZON JU Research and Innovation ActionsCoordinator
80686 Munchen
Germany