The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.

Informations projet

Impulse Printing

N° de convention de subvention: 101189143

DOI

10.3030/101189143

Date de signature de la CE 8 Decembre 2024

Date de début 1 Janvier 2025

Date de fin 31 Decembre 2026

Financé au titre de

• The European Innovation Council (EIC)

Coût total

Aucune donnée

Contribution de l’UE

€ 2 445 035,98

Coordonné par

FONONTECH HOLDING BV
Netherlands

Periodic Reporting for period 1 - Impulse Printing (The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.)

Période du rapport: 2025-01-01 au 2025-12-31

Résumé du contexte et des objectifs généraux du projet

Advanced semiconductor packaging requires precise formation of conductive interconnects at scales ranging down to the micrometer size. Current manufacturing approaches rely predominantly on subtractive processes (lithography, etching) or additive nozzle-based dispensing. Subtractive methods generate significant material waste and require extensive chemical processing. Nozzle-based additive methods, while reducing waste, are limited to sequential deposition rates, creating production bottlenecks for high-volume manufacturing.
Impulse Printing addresses this throughput limitation through a mask-based parallel deposition technology. The technology enables simultaneous transfer of metallic materials from a printing plate to a substrate, achieving deposition rates of over100,000 interconnects per second. This represents a throughput increase of four orders of magnitude compared to sequential dispensing methods.
The project objectives are structured around two product categories: (1) Impulse Printing plates, which serve as the consumable transfer medium containing the deposition pattern, and (2) Impulse Printheads, which provide the controlled energy input for material transfer. The grant-funded activities target technology readiness level advancement from TRL 5 to TRL 7, focusing on scalable plate manufacturing processes, printhead productization, and industrial validation with semiconductor packaging customers.
The expected impact includes enabling European semiconductor manufacturers to adopt additive interconnect deposition without throughput penalties. Environmental benefits derive from reduced material consumption, elimination of chemical etching steps, and lower energy requirements per interconnect compared to conventional lithography-based processes.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

Work performed and main achievements
During the first reporting period (M1-M12), work concentrated on three parallel development tracks: baseline plate scalability, printhead productisation, and customer validation preparation.
Plate development (WP1, WP2): The baseline impulse plate manufacturing process was successfully scaled from laboratory-scale (50mm diameter) to production-relevant dimensions (200mm diameter). Process parameters for heater stack deposition, stencil patterning, and material loading were transferred to an external production facility. Initial production batches demonstrated print counts exceeding the minimum specification of 1,000 prints per plate. Work on high-resolution engraved plates (WP2) commenced with design iterations for feature sizes below 30 micrometres.
Printhead development (WP3, WP4): The baseline printhead underwent design modifications for improved serviceability and manufacturing repeatability. Thermal management subsystems were redesigned to support continuous operation cycles required for production environments. Documentation packages for printhead assembly and calibration were prepared to support future volume manufacturing.
Process validation (WP5): Collaboration with a European semiconductor manufacturer established baseline process parameters for a specific packaging application. Initial test prints demonstrated feature placement accuracy within specification. Preparation work for extended reliability testing was completed.
Infrastructure: Laboratory facilities were expanded to accommodate parallel testing of multiple printhead-plate combinations. Metrology capabilities were enhanced with automated print inspection equipment.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

The project has demonstrated two results that advance beyond current industrial capabilities for interconnect deposition:
High-power pulsed heating elements: The core technology relies on resistive heating elements that deliver energy in short pulses During the pulse, the heating elements achieve power densities surpass the power density at the surface of the sun. This extreme localised energy delivery enables rapid material transfer while limiting thermal exposure of the substrate. Due to the short pulse, the printhead uses less power than a lightbulb. Reliable operation at these power densities has been demonstrated across multiple plate production batches.
Massive parallel transfer capability: The printhead architecture was validated using an array of 256 independently addressable heating elements arranged in a 16×16 configuration, with each element measuring circa 8×8 mm. This parallel architecture enables simultaneous transfer across the full array in a single print cycle. When combined with substrate handling and stepping operations, the demonstrated configuration supports throughput rates in the range of millions of units per hour per machine. This throughput level exceeds sequential dispensing methods by approximately four orders of magnitude and approaches the production rates required for high-volume semiconductor packaging lines.
For continued technology uptake, establishment of volume plate manufacturing capacity is necessary to support multiple simultaneous customers in HVM manufacturing.