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Verwertbare Ergebnisse
Attempting to minimise device size, production cost, and to maximise performance, microsystem technologies (MST) or micro-electromechanical systems (MEMS) are explored for realising so-called "microrelays". An electromagnetically driven microrelay consisting of two chips assembled using a flip-chip technique has been realized in the framework of MIRS. The lower chip uses a ferromagnetic (FeSi) substrate and comprises a U-core electromagnet, consisting of two coils and the ferromagnetic poles, and the lower electrical contact. The top chip includes a moving ferromagnetic keeper with the upper contact. Upon energising the coil, the keeper will be attracted towards the poles thus closing the contacts. The contacts are sealed in a hermetic cavity and the resulting assembly is housed in ceramic and in plastic packages .The device is typically 5x5 mm2, but size reductions of up to 30% are considered feasible. Working demonstrators with an integrated coil and Au contacts sealed in forming gas have been successfully built and tested. Device performance is encouraging and the work at this moment is focused on the implementation of better (harder) contact materials.
The device is still under development and is not yet used in a real commercial application. Target markets are security and automatic test equipment (ATE). However, microrelays can be applied to other markets as well, e.g., for RF (Radio Frequency) or microwave switching for wireless telecom applications. Key advantages of microrelays include: small size and low weight, batch fabrication is possible (thus allowing low manufacturing costs), realisation of multiple relays in a single package or on a single substrate is possible and added-value by integration of electronics is only a small step. Drawbacks include the limited power handling capability and the maximum achievable contact force (scales down with size). Further, large investments and high risks are required since the technology is new.
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