Project description Next-Generation Nanoelectronics Components and Electronics IntegrationThe main SIDAM objective is to develop a cost-effective metrology tool that would detect substrate damage and predict yield loss. Show the project objective Hide the project objective Wafer handling in semiconductor manufacturing introduces microcracks at the wafer edge. During thermal processing, some of these grow into slip bands; on rapid thermal processing some of these grow into cracks, shattering the wafer and disrupting manufacture. Dense slip bands also lead to yield loss by locally increasing diffusion rates. Breakage losses alone were of the order of €2.5M p.a. for a single fab line at the 90 nm node. Microcracks and slip bands are visible through X-ray Diffraction Imaging (XRDI); but it is unknown which of the many defects imaged are those that will result in yield loss and breakage. We aim to discover how to derive quantitative, predictive information from XRDI, enabling a breakthrough metrology of wafer inspection. The project will comprise quantification of the XRDI images, modelling of the stresses introduced by the controlled defects, modelling the influence of thermal gradients in RTA upon the defects, and experimental confirmation of the conclusions. The outcome of this research will offer a competitive advantage at several levels to those members of the European Semiconductor Industry who agree to join the Industrial Advisory Board. European wafer manufacturers will have early access to a technique that reveals the nature of the defects in the wafers and their relevance to semiconductor device fabrication. This could provide Europe with a competitive advantage in the development of both 450mm and thin silicon wafers. European wafer and equipment manufacturers will have early access to a unique and specifically developed body of open knowledge to aid them in the evaluation of risk of breakage during their processes. They will have a choice of access to off-line characterization of defects by XRDI at ANKA or an in-line wafer inspection tool commercialized by Bede plc. The knowledge and tools developed will contribute to maintaining Europe's leading position in semiconductor x-ray metrology. Fields of science engineering and technologymechanical engineeringmanufacturing engineeringnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural scienceschemical sciencesinorganic chemistrymetalloids Programme(s) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Topic(s) ICT-2007.3.1 - Next-generation nanoelectronic components and electronics integration Call for proposal FP7-ICT-2007-1 See other projects for this call Funding Scheme CP - Collaborative project (generic) Coordinator UNIVERSITY OF DURHAM Address Stockton road the palatine centre DH1 3LE Durham United Kingdom See on map Region North East (England) Tees Valley and Durham Durham CC Activity type Higher or Secondary Education Establishments Administrative Contact Wendy Harle (Ms.) Links Contact the organisation Opens in new window Website Opens in new window EU contribution € 441 576,00 Participants (7) Sort alphabetically Sort by EU Contribution Expand all Collapse all KARLSRUHER INSTITUT FUER TECHNOLOGIE Germany EU contribution € 181 475,00 Address Kaiserstrasse 12 76131 Karlsruhe See on map Region Baden-Württemberg Karlsruhe Karlsruhe, Stadtkreis Activity type Higher or Secondary Education Establishments Administrative Contact Natascha Wallburg (Ms.) Links Contact the organisation Opens in new window Website Opens in new window ALBERT-LUDWIGS-UNIVERSITAET FREIBURG Germany EU contribution € 164 100,00 Address Fahnenbergplatz 79098 Freiburg See on map Region Baden-Württemberg Freiburg Freiburg im Breisgau, Stadtkreis Activity type Higher or Secondary Education Establishments Administrative Contact Klaus Dueformantel (Herr) Links Contact the organisation Opens in new window Website Opens in new window FORSCHUNGSZENTRUM KARLSRUHE GMBH Participation ended Germany EU contribution € 168 786,00 Address Weberstrasse 5 76133 Karlsruhe See on map Activity type Higher or Secondary Education Establishments Administrative Contact Rolf Brannath (Mr.) Links Contact the organisation Opens in new window Website Opens in new window ASOCIACION CENTRO TECNOLOGICO CEIT Spain EU contribution € 540 120,00 Address Paseo manuel de lardizabal 15 20018 San sebastian See on map Region Noreste País Vasco Gipuzkoa Activity type Research Organisations Administrative Contact José Ignacio de Carlos (Mr) Links Contact the organisation Opens in new window Website Opens in new window DUBLIN CITY UNIVERSITY Ireland EU contribution € 225 509,00 Address Glasnevin 9 Dublin See on map Region Ireland Eastern and Midland Dublin Activity type Higher or Secondary Education Establishments Administrative Contact EUGENE KENNEDY (PROF.) Links Contact the organisation Opens in new window Website Opens in new window Jordan Valley Semiconductors UK Ltd United Kingdom EU contribution € 328 431,00 Address Belmont business park belmont DH1 1TW Durham See on map Region North East (England) Tees Valley and Durham Durham CC Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Administrative Contact Paul Ryan (Dr.) Links Contact the organisation Opens in new window BEDE SCIENTIFIC INSTRUMENTS LIMITED Participation ended United Kingdom EU contribution € 0,00 Address Belmont business park DH1 1TW Durham See on map Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Administrative Contact David Hall (Mr) Links Contact the organisation Opens in new window
